Multi-Die Package Separate Interconnects for Layout Flexibility
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Solution Overview
Problem
Conventional single-clip inter-die connections in multi-die packages face challenges due to different electrode topologies and limitations in design and placement of semiconductor dies, particularly when multiple dies are used, as they restrict die rotation and flexibility in assembly.
Innovation Solution
The use of separate metal layers with a generally rectangular cross-sectional area to connect electrodes of multiple semiconductor dies to the same potential, allowing for greater flexibility in die layout and interconnect placement, including the ability to orientate connections at different angles, thereby enabling improved integration and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single metal clip is used to connect electrodes of multiple dies, then electrical connection is achieved, but design flexibility and die placement freedom are limited
Solution Approach 1:
The invention divides the interconnect structure into multiple separate metal clips instead of using a single metal clip. Each metal clip can independently connect to different electrodes on different dies, allowing flexible die placement and orientation while maintaining reliable electrical connections. The segmented approach enables the first metal clip to connect first electrodes to a first conductive region and the second metal clip to connect second electrodes to a second conductive region independently.
Solution Approach 2:
The invention introduces spatial dimensionality by allowing metal clips to extend in different directions and planes. The metal clips can have L-shaped, T-shaped, or other complex geometries that extend over multiple dies from different orientations, enabling connections in three-dimensional space rather than being constrained to a single plane or direction.
2Reliability
If conventional metal clips are used for inter-die connection, then electrical connectivity is provided, but thermal conductivity is insufficient
Solution Approach 1:
The invention merges multiple functions into the metal clip structure. The metal clips serve both as electrical interconnects and as thermal management elements. By extending the metal clips to contact multiple dies and conductive regions, they create additional thermal pathways for heat dissipation while maintaining electrical connectivity, thus addressing both electrical and thermal requirements simultaneously.
3Reliability
If large metal clips are used for connection, then electrical and thermal properties improve, but die rotation and placement flexibility are restricted
Solution Approach 1:
By segmenting the interconnect function across multiple smaller metal clips rather than using one large clip, the invention maintains adequate electrical and thermal properties through cumulative contact area while enabling greater die rotation flexibility. Each smaller clip can be positioned and oriented independently to accommodate different die orientations without requiring a single large clip that would constrain placement options.
Data Source
AI summary
A first electrode at a first side of a first semiconductor die is connected to a first conductive region of a substrate. A first electrode at a first side of a second semiconductor die is connected to a second conductive region of the substrate. Each die has a second electrode at an opposing second side of the respective die. A first metal layer extends from a periphery region of the substrate to over the first die. The first metal layer has a generally rectangular cross-sectional area and connects one of the conductive regions in the periphery region of the substrate to the second electrode of the first die. A second metal layer separate from the first metal layer extends over the first and second dies. The second metal layer has a generally rectangular cross-sectional area and connects the second electrodes of the first and second dies.