Multi-Die Package Structure for Low-Reflection Signal Routing
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in achieving efficient signal transmission between multiple dies, which is crucial for developing small, lightweight, and high-density electronic products.
Innovation Solution
A package structure and manufacturing method involving a first die, a second die, a dielectric body, a conductive terminal, and a circuit layer, where the first circuit portion penetrates the dielectric body, and the second circuit portion is embedded within it, enabling electrical connections between the dies through conductive terminals, with a patterned insulating layer covering the circuit layer and embedded in the dielectric body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional packaging technology is used to achieve small size and high density, then the electronic products can be made light and thin, but the signal transmission quality and efficiency between multiple dies deteriorates
Solution Approach 1:
The circuit layer is segmented into multiple portions (first circuit portion, second circuit portion, third circuit portion) with different configurations. The first circuit portion has a first pitch, the second circuit portion has a second pitch different from the first, and the third circuit portion has a third pitch different from both. This segmentation allows each portion to be optimized for specific signal transmission requirements, reducing signal reflection and impedance mismatch while maintaining compact package size.
Solution Approach 2:
Different regions of the circuit layer are assigned different local qualities through varying pitch configurations. The first circuit portion, second circuit portion, and third circuit portion each have distinct pitch values tailored to their specific functional requirements. This local quality approach enables optimal signal transmission in different areas of the package without compromising overall compactness.
2Productivity
If multiple dies are integrated in a compact package, then high density is achieved, but signal reflection and impedance mismatch increase
Solution Approach 1:
The circuit layer is divided into multiple segmented portions with different pitch configurations. The first circuit portion, second circuit portion, and third circuit portion are spatially separated and each handles specific signal transmission tasks. This segmentation reduces signal reflection and impedance mismatch by providing dedicated transmission paths with optimized characteristics for different signal types or destinations.
Solution Approach 2:
Each circuit portion is assigned a specific pitch value optimized for its local signal transmission requirements. The first circuit portion has a first pitch, the second circuit portion has a second pitch, and the third circuit portion has a third pitch. This local optimization allows high integration density while maintaining signal transmission efficiency by matching the circuit structure to the specific electrical characteristics needed in each region.
Data Source
AI summary
A package structure including a first die, a second die, a dielectric body, a conductive terminal, a circuit layer and a patterned insulating layer is provided. The second die is disposed on the first die. A second active surface of the second die faces a first active surface of the first die. The dielectric body covers the first die. The conductive terminal is disposed on the dielectric body and opposite to the second die. The circuit layer includes a first circuit portion and a second circuit portion. The first circuit portion penetrates the dielectric body. The first die is electrically connected to the conductive terminal through the first circuit portion. The second circuit portion is embedded in the dielectric body. The second die is electrically connected to the first die through the second circuit portion. The patterned insulating layer covers the circuit layer and is embedded in the dielectric body.