Multi-Die Package Substrate Layout for High-Bandwidth Die Links
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Solution Overview
Problem
Existing semiconductor devices face challenges in efficiently integrating multiple dies with effective communication channels, leading to space inefficiencies and suboptimal performance due to the need for integrated circuitry between dies.
Innovation Solution
A semiconductor device with multiple dies is designed using a multi-layer package substrate that includes transmission line structures with specific dimensions and configurations, such as single-ended or differential signaling structures, to establish communication channels with predetermined characteristic impedances, and features like apertures in the ground plane to adjust impedance, thereby enabling efficient communication between dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple dies are integrated with traditional interconnect methods, then communication between dies is achieved, but space efficiency deteriorates due to the need for integrated circuitry between dies
Solution Approach 1:
The patent replaces traditional mechanical/electrical interconnect methods (wires, traces, integrated circuitry) with optical interconnects using waveguides. Light signals are transmitted through the substrate between dies, eliminating the need for complex electrical interconnection structures and reducing the space required for communication channels.
Solution Approach 2:
The patent introduces waveguides as intermediary structures that facilitate communication between dies. These waveguides act as dedicated optical channels embedded in the substrate, providing a streamlined path for data transmission without requiring traditional electrical interconnect layers or routing structures.
2Reliability
If traditional interconnect structures are used, then die coupling is achieved, but performance deteriorates due to suboptimal communication channels
Solution Approach 1:
The patent substitutes electrical signal transmission through complex trace networks with optical signal transmission through waveguides. This provides superior signal integrity, higher bandwidth, and lower loss characteristics while eliminating the complexity of electrical interconnect routing, impedance matching, and signal integrity management associated with traditional methods.
Data Source
AI summary
A semiconductor device includes a first die having ports and a second die having ports. The semiconductor device includes a multi-layer package substrate. The multi-layer package substrate includes a first layer patterned to include pads for the ports of the first die and the second die and a second layer patterned to provide vias between the pads for the ports of the first die and pads for the ports of the second die and a third layer of the multi-layer package substrate. The third layer is patterned to provide traces that couple the vias coupled to ports of the first die to vias coupled to ports of the second die to couple the first die to the second die, the traces of the third layer having a width. The multi-layer package substrate also includes a fourth layer underlying the third layer and a ground plane underlying the fourth layer.