Multi-Die Transmission Line Termination Optimization

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Solution Overview

Problem

Impedance mismatches in signal paths within memory systems lead to energy reflections, degrading signal integrity and performance, as different segments often have varying characteristic impedances.

Innovation Solution

The implementation of a system where a controller die and memory dies are configured to set termination resistance circuits to specific levels, with the end die setting a low resistance level and other dies setting high or low resistance levels to match the characteristic impedance of the transmission line, optimizing signal communication efficiency and quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If different segments of the transmission line have varying characteristic impedances, then the transmission line can be constructed with different components and layouts, but energy reflections occur leading to degraded signal integrity

Engineering Contradiction:
Improvetransmission line configuration flexibilityVSAvoidsignal integrity
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent applies local quality by making different dies (components) have different termination resistance characteristics. Specifically, the end die has a first termination resistance value while intermediate dies have a second termination resistance value, creating localized impedance variations that optimize signal transmission through each segment while maintaining overall signal integrity

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent changes the resistance parameter of different dies to optimize signal transmission. By setting termination resistance values differently for end dies versus intermediate dies, the system transforms a uniform transmission line into a optimized multi-segment line that minimizes reflections while allowing configuration flexibility

Inventive Principle:
Principle #35Parameter changes

2Reliability

If termination resistance circuits are set to different levels for different dies, then energy reflections are reduced and signal quality improves, but the system complexity increases

Engineering Contradiction:
Improvesignal qualityVSAvoidtermination resistance configuration
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent segments the transmission line into different functional zones: end dies with one termination resistance value and intermediate dies with another value. This segmentation allows each zone to be optimized for its specific function while reducing overall system complexity compared to individually optimizing each component

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent creates universal termination resistance configurations where intermediate dies all use the same second termination resistance value and end dies all use the first termination resistance value. This multi-functionality approach simplifies the system by having repeated identical configurations rather than unique settings for each die

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS10468073B2Transmission line optimization for multi-die systems
Publication Date: 2019.11.05 SANDISK TECHNOLOGIES LLC
  • US10468073B2 patent drawing
  • US10468073B2 patent drawing
  • US10468073B2 patent drawing

AI summary

An apparatus may include a controller die configured to communicate with a plurality of dies via a transmission line. The controller die may be configured to transmit a signal on the transmission line to a target die of the plurality of dies, or the target die may transmit a signal on the transmission line. The transmission may be dependent on an end die of the plurality of dies setting an end-die termination resistance to a low level. In situations where the target memory is receiving the signal, the target die may set target an on-die termination resistance to a high level. In situations where the target memory die is transmitting the signal, the target die may set an on-die termination resistance to a low level.