Multi-Die Voltage Regulator Sequencing for Independent Supply Rails
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Solution Overview
Problem
In electronic systems with multiple integrated circuit dies, the use of a single on-package or on-board voltage regulator leads to inefficiencies, increased complexity, and higher costs due to the need for all dies to operate at the same supply voltage, lacking voltage margining and binning, and requiring power shorting between dies.
Innovation Solution
Each integrated circuit die in the package or electronic system is individually controlled by its own on-package or on-board voltage regulator, allowing each die to receive a different supply voltage based on its specific needs, and the voltage regulators power up the dies in a predefined sequencing order.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single voltage regulator is used to control power for multiple integrated circuit dies, then device complexity is reduced, but manufacturing precision and adaptability deteriorate because all dies must operate at the same supply voltage without voltage margining
Solution Approach 1:
The patent divides the single voltage regulator into multiple individual voltage regulators, with each die having its own dedicated regulator. This segmentation allows each die to operate at independently optimized voltage levels, enabling voltage margining and binning to compensate for process variations while maintaining manageable device complexity through modular architecture
Solution Approach 2:
The patent applies local quality by allowing each integrated circuit die to have its own specific supply voltage tailored to its performance characteristics. This enables different regions of the system (individual dies) to have different operational parameters, optimizing overall system performance while accommodating manufacturing variations
2Device complexity
If a single voltage regulator provides supply current for all integrated circuit dies, then device complexity is reduced, but productivity deteriorates due to increased board layer requirements for power shorting
Solution Approach 1:
The patent segments the power distribution architecture by providing each die with its own voltage regulator and dedicated power path. This eliminates the need for complex board layer shorting arrangements, reducing manufacturing complexity and production costs while improving power distribution efficiency
Solution Approach 2:
The patent extracts the power shorting function from the board layer implementation by providing direct power paths from each voltage regulator to its associated die. This removal of the shorting requirement simplifies board design and reduces production costs
3Device complexity
If all integrated circuit dies operate at the same supply voltage, then device complexity is reduced, but adaptability deteriorates because unused dies cannot be turned off for power saving
Solution Approach 1:
The patent segments the power control mechanism by providing individual voltage regulators for each die, enabling independent power control. This allows the system to turn off unused dies individually to save power while maintaining simple control logic through modular regulation units
Solution Approach 2:
The patent applies dynamics by enabling the supply voltage to each die to be dynamically adjusted or completely shut off based on operational requirements. This provides power management flexibility where unused dies can be turned off individually, adapting the system's power consumption to actual usage patterns
Data Source
AI summary
An electronic system includes first, second, third, and fourth integrated circuit dies. The third integrated circuit die has a first voltage regulator circuit. A supply voltage output of the first voltage regulator circuit is coupled to provide a first supply voltage to a supply voltage input of the first integrated circuit die. The first voltage regulator circuit generates a first power ready signal that indicates when the first supply voltage has reached a first threshold voltage. The fourth integrated circuit die has a second voltage regulator circuit that generates a second supply voltage in response to the first power ready signal. A supply voltage output of the second voltage regulator circuit is coupled to provide the second supply voltage to a supply voltage input of the second integrated circuit die.