Multi-dimensional column-based heat dissipation features for datacenter cooling systems

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Solution Overview

Problem

Datacenter cooling systems face inefficiencies due to the use of cylindrical vapor columns, which create vortices and disrupt airflow or fluid flow, leading to lower heat dissipation and increased pressure drops, particularly in high heat density computing environments with varying cooling requirements.

Innovation Solution

The implementation of multi-dimensional column-based heat dissipation features with irregular cross-sections, such as elliptical or oblong shapes, that are aligned with the axial flow path to reduce vortices and enhance airflow or fluid flow efficiency, allowing for streamlined cooling media passage and improved thermal performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If cylindrical vapor columns are used for heat dissipation, then the structure is simple and easy to manufacture, but vortices are created that disrupt airflow and reduce heat dissipation efficiency

Engineering Contradiction:
Improveease of manufactureVSAvoidheat dissipation efficiency
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The patent applies asymmetry by transitioning from symmetric cylindrical columns to asymmetric multi-dimensional columns with irregular cross-sections. The columns feature a longest dimension, a middle dimension, and a shortest dimension, where the middle dimension is offset from parallel to the axial flow path. This asymmetric geometry disrupts vortex formation while maintaining manufacturing feasibility, thereby improving heat dissipation efficiency without completely sacrificing ease of manufacture.

Inventive Principle:
Principle #4Asymmetry

2Device complexity

If cylindrical vapor columns are used for heat dissipation, then the design is simple, but pressure drops increase due to vortex creation

Engineering Contradiction:
Improvedesign complexityVSAvoidpressure drop
Core Design Contradiction:
Device complexityVSStress or pressure

Solution Approach 1:

The asymmetric multi-dimensional column design with offset middle dimension prevents vortex formation by disrupting the rotational flow patterns that occur with cylindrical columns. This geometric modification reduces pressure drops across the heat dissipation array while the overall structural simplicity maintains reasonable design complexity.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The patent transitions from two-dimensional circular cross-sections to three-dimensional multi-dimensional columns with varying dimensions along different axes. By introducing a middle dimension that is offset from parallel to the flow path, the design adds geometric complexity in a controlled way that specifically targets vortex reduction and pressure drop minimization.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Ease of manufacture

If traditional cylindrical columns are used, then manufacturing is easier, but heat transfer efficiency is lower due to boundary layer separation

Engineering Contradiction:
Improveease of manufactureVSAvoidheat transfer efficiency
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

The asymmetric geometry with offset middle dimension prevents boundary layer separation by eliminating the symmetric flow detachment that occurs at the rear of cylindrical columns. This maintains more attached flow over the column surface, improving convective heat transfer efficiency while the manufacturing process remains relatively straightforward.

Inventive Principle:
Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces pressure drops and enhances heat dissipation by minimizing vortices and boundary layer separation, achieving superior thermal performance and more efficient airflow or fluid flow, while maintaining structural integrity and allowing for lighter heat sinks.

Implementation Method 1

a number of multi-dimensional column-based heat dissipation features for cooling by a cooling media flowing there through

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

cooling by a cooling media flowing there through

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

enhance airflow or fluid flow efficiency, allowing for streamlined cooling media passage

Methodology Applied
Scientific EffectFluid flow:

Implementation Method 4

minimizing vortices and boundary layer separation

Methodology Applied
Scientific EffectBoundary layer separation: Boundary Layer

Implementation Method 5

reduce vortices

Methodology Applied
Scientific EffectVortex: Vortex Ring

Implementation Method 6

reduce pressure drops

Methodology Applied
Scientific EffectPressure drop: Pressure Drop

Data Source

PatentUS12150284B2Multi-dimensional column-based heat dissipation features for datacenter cooling systems
Publication Date: 2024.11.19 NVIDIA CORP
  • US12150284B2 patent drawing
  • US12150284B2 patent drawing
  • US12150284B2 patent drawing

AI summary

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a number of multi-dimensional column-based heat dissipation features enable cooling by a cooling media flowing there through so that an individual heat dissipation column having a first dimension and a second dimension may be supported, with the first dimension being normal relative to an axial flow path of the cooling media, with the second dimension being parallel or offset from parallel relative to the axial flow path and with the second dimension being more than the first dimension.