Multi-Directional Heat Dissipation Structure for Electronic Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-performance processors in electronic devices generate heat, leading to performance limitations and potential overheating, with existing heat dissipation structures often resulting in hot spots on device surfaces due to inefficient heat transfer.
Innovation Solution
A heat dissipation structure comprising a housing with a cooling member, a circuit board, heating components, a shield can, conducting members, and multiple heat conducting members that dissipate heat in parallel and perpendicular directions to effectively transfer heat away from the processor, preventing hot spots on the device surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the processor performance is increased, then the processing capability is improved, but the heat generation increases causing overheating issues
Solution Approach 1:
The patent transitions from single-direction heat dissipation to multi-directional heat dissipation by adding heat conducting members that extend in both first and second directions from the heating component, effectively utilizing three-dimensional space for heat distribution
Solution Approach 2:
The heat dissipation structure is divided into multiple independent heat conducting members (first heat conducting member in the first direction, second heat conducting member in the second direction) that work in parallel to dissipate heat from different surfaces of the heating component
2Temperature
If heat is dissipated in multiple directions, then the heat distribution is improved, but the device structure becomes more complex
Solution Approach 1:
The housing serves multiple functions: it provides structural support for the device and simultaneously acts as a heat dissipation pathway by incorporating heat conducting members that extend to its surfaces, eliminating the need for separate dedicated heat dissipation components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed structure efficiently dissipates heat from heating components, reducing the likelihood of hot spots on the device surface and maintaining performance by ensuring effective heat transfer and cooling.
Implementation Method 1
a first heat conducting member dissipating heat from the at least one heating component in a first direction
Implementation Method 2
a second heat conducting member contacting a first surface of the first heat conducting member, receiving the heat from the first heat conducting member in a second direction perpendicular to a first direction, and transferring the heat to the cooling member
Data Source
AI summary
An electronic device, according to various embodiments of the present invention, may comprise: a housing which comprises a first surface, a second surface facing the opposite direction from the first surface, and a cooling member arranged between the first surface and the second surface; a circuit board which is disposed inside the housing; at least one heating component which is mounted to the circuit board; a shield can which surrounds one portion of the at least one heating component; a conductive member which makes contact with a first surface of the at least one heating component; a first thermal conduction member which diffuses heat from the at least one heating component to a plane direction parallel with the first surface of the heating component; and a second thermal conduction member which makes contact with a first surface of the first thermal conduction member, receives the heat from the first thermal conduction member in a second direction perpendicular to the plane direction, and transfers the heat to the cooling member. In addition, various embodiments are possible.