Multi-Disc Electrostatic Chuck Bonding for High-Temperature Reliability
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Solution Overview
Problem
Electrostatic chucks used in substrate processing fail at high temperatures due to issues such as de-chucking, plasma erosion, and bond reliability, limiting their effectiveness in high-temperature processes.
Innovation Solution
A method involving the application of melting point depressing layers (MDLs) to puck plates, a metal interlayer, and thermal bonding at eutectic temperatures to create a substrate support assembly that can withstand high temperatures, along with methods for debonding and repairing the assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional electrostatic chucks are used in high-temperature processes, then substrate processing can be performed, but the chuck components fail due to de-chucking, plasma erosion, and bond reliability issues
Solution Approach 1:
The electrostatic chuck is divided into multiple separate puck plates (first puck plate, second puck plate, third puck plate) that can be individually replaced. The bonding layers between these plates are designed to be replaceable, allowing the chuck to be disassembled, repaired, and reassembled. This segmentation enables maintenance of high-temperature reliability without replacing the entire chuck assembly.
Solution Approach 2:
The patent applies parameter changes by modifying the bonding structure to use temperature-resistant materials and designs. The bonding layers are specifically engineered to maintain adhesion at high temperatures (above 120°C) through controlled material selection and bonding process parameters, thereby improving bond reliability in high-temperature environments.
2Temperature
If traditional electrostatic chucks are used in high-temperature processes, then substrate processing can be performed, but the chuck components fail due to de-chucking, plasma erosion, and bond reliability issues
Solution Approach 1:
Different regions of the electrostatic chuck are given different protective qualities. The outer peripheral region includes a protective layer that is specifically designed to resist plasma erosion, while the inner region maintains the electrostatic chucking function. This local differentiation allows the chuck to withstand plasma erosion in high-temperature processes without compromising overall performance.
3Ease of manufacture
If a unitary electrostatic chuck design is used, then manufacturing is simpler, but repair and maintenance become difficult
Solution Approach 1:
The electrostatic chuck is segmented into multiple replaceable puck plates and bonding layers. This segmentation transforms the traditionally non-repairable unitary design into a modular system where individual components can be inspected, replaced, or repaired independently. The first, second, and third puck plates can be separately handled during maintenance, significantly improving repairability while maintaining manufacturing feasibility through standardized assembly processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the use of electrostatic chucks in high-temperature processes by enhancing adhesion, mechanical properties, and chemical resistance, allowing for modular repair and maintenance of substrate support assemblies.
Implementation Method 1
heating the puck assembly to a eutectic temperature of the melting point depressing layer to bond the first puck plate to the second puck plate
Implementation Method 2
electrostatic chucks typically include one or more electrodes embedded within a unitary chuck body which includes a dielectric or semi-conductive ceramic material across which an electrostatic clamping field can be generated
Data Source
AI summary
A method for bonding components of an electrostatic chuck includes applying a first melting point depressing layer (MDL) to a bottom surface of a first puck plate including one or more functional elements of an electrostatic chuck. A second MDL is applied to a top surface of a second puck plate including one or more functional elements of the electrostatic chuck, and a metal interlayer is provided between the first MDL and the second MDL. The first puck plate, the metal interlayer, and the second puck plate are aligned to form a puck assembly, and the puck assembly is heated, to a temperature at or near the eutectic temperature of the first MDL or the second MDL, to thermally bond the first puck plate to the metal interlayer and the metal interlayer to the second puck plate.