Multi-display Apparatus Etched Panel Seam Alignment
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Solution Overview
Problem
Conventional multi-display apparatuses experience image disconnection at seams between panels due to the thickness of cover glass, which limits the improvement of image connection and increases the overall thickness of the device, making it less competitive in the market.
Innovation Solution
The method involves preparing unit panels with etched portions that overlap in the thickness direction, allowing for seamless image connection without increasing the thickness of the multi-display apparatus, by forming etched portions on the main bodies of the panels before or after separation, and aligning the upper surfaces horizontally with an optical film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If unit panels are connected in parallel with cover glass, then image connection at seams is improved, but the overall thickness of the apparatus increases
Solution Approach 1:
The patent extracts the cover glass from the equation by using etched portions that eliminate the need for cover glass at the seam areas. The etched portions create recesses where the display devices of adjacent panels can be positioned at the same level without requiring thick cover glass to bridge the gap, thus removing the thickness constraint while maintaining image connection.
Solution Approach 2:
The patent transitions from a two-dimensional parallel connection approach to a three-dimensional etched connection approach. By creating etched portions that extend into the thickness dimension of the panel, the invention allows display devices to be aligned at the same level across seams while maintaining a thin overall profile, effectively using the depth dimension to solve a surface-level problem.
2Manufacturing precision
If cover glass thickness is reduced to minimize image disconnection, then image connection improves, but protection of display devices is compromised
Solution Approach 1:
The patent segments the panel structure into etched portions and non-etched portions. The etched portions are strategically located at seam areas where image connection is critical, allowing these specific regions to have reduced thickness while the rest of the panel maintains full cover glass protection. This segmentation enables localized thickness reduction without compromising overall device protection.
Solution Approach 2:
The patent applies different structural qualities to different regions of the panel. At seam locations, etched portions create a local quality of reduced thickness to enable image connection, while other regions maintain the standard cover glass thickness for protection. This local differentiation allows the patent to optimize both image connection and device protection simultaneously.
3Manufacturing precision
If panels are connected with step difference to align pixel boundaries, then image disconnection is minimized, but the structure becomes more complex and thicker
Solution Approach 1:
Instead of creating step differences between panels to align pixel boundaries, the patent inverts the approach by creating etched portions that allow panels to be positioned at the same level. This inversion eliminates the need for complex step structures while achieving the same image connection goal, simplifying the overall panel connection structure.
Data Source
AI summary
Provided are a multi-display apparatus and a method of manufacturing the multi-display apparatus. The method includes preparing a pair of unit panels respectively comprising display devices, etching main bodies of the pair of unit panels, and connecting the pair of unit panels so that etched portions of the main bodies of the unit panels overlap in a thickness direction of the unit panels.