Multi-Duct Heat Dissipation for Electronic Apparatus
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Solution Overview
Problem
In electronic devices like digital cameras, the reduced space and increased heat generation due to higher image quality and frame rates lead to inefficient heat dissipation, causing temperature rises in image pickup devices and recording media, as conventional heat dissipation methods struggle to manage heat from multiple sources effectively.
Innovation Solution
The implementation of a multi-duct system that separates and dissipates heat from multiple heat sources, including an image pickup device, main circuit board, and recording medium, using strategically placed intake and exhaust ports with air blower assistance to prevent heat transfer between components and enhance cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single heat dissipation duct is used to dissipate heat from both the main circuit board and image pickup device, then the device structure is simplified, but heat from the main circuit board transfers to the image pickup device causing temperature rise
Solution Approach 1:
The patent divides the heat dissipation system into separate ducts: a first heat dissipation duct for the image pickup device and a second heat dissipation duct for the main circuit board. This segmentation prevents heat transfer between components while maintaining manageable structural complexity.
Solution Approach 2:
The patent extracts the heat dissipation paths for different components into separate dedicated ducts. The first duct is specifically extracted for the image pickup device and the second duct for the main circuit board, eliminating harmful heat transfer between them.
2Power
If the main circuit board generates large amounts of heat, then processing power is improved, but the heat cannot be fully dissipated causing temperature rise in recording medium
Solution Approach 1:
The patent segments the heat dissipation system into component-specific ducts, with the second duct dedicated to the main circuit board and positioned to prevent heat transfer to the recording medium. This allows high-power processing while controlling thermal impact on other components.
Solution Approach 2:
The second heat dissipation duct acts as an intermediary structure between the main circuit board and the recording medium. It provides a dedicated heat dissipation path that mediates the thermal interaction, allowing the main circuit board to operate at high power without overheating the recording medium.
3Volume of moving object
If space between circuit boards is reduced to minimize device size, then device compactness is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent utilizes the vertical dimension by positioning heat dissipation ducts between stacked circuit boards (image pickup device board and main circuit board). This three-dimensional arrangement enables effective heat dissipation in a compact footprint by exploiting the vertical space between components.
Solution Approach 2:
The patent segments the compact device into multiple layers with dedicated heat dissipation ducts positioned between circuit boards. This segmentation allows efficient heat management within the reduced vertical space, maintaining thermal performance despite compact dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the influence of heat from one source on others, ensuring efficient heat dissipation and maintaining optimal operating temperatures for electronic components within the device.
Implementation Method 1
a heat dissipation duct which takes in air from intake ports and discharges the air from exhaust ports, by an air blower
Implementation Method 2
for dissipating heat from the image pickup device and the heat from the main circuit board to the outside
Data Source
AI summary
An electronic apparatus capable of separating and dissipating heat generated by a plurality of heat sources. The electronic apparatus includes a main circuit board and an image pickup device unit, as heat sources. A first duct unit is disposed between the main circuit board and the image pickup device unit, and dissipates heat from the image pickup device unit to an outside. A second duct unit is disposed at a position where the second duct unit and the first duct unit sandwich the main circuit board, and dissipates heat from the main circuit board to the outside.