Multi-Electrode Chuck Electrostatic Particle Removal

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Solution Overview

Problem

Existing techniques for removing foreign particles from substrate surfaces during semiconductor processing often damage underlying layers and patterns, highlighting the need for improved methods that can effectively loosen and remove particles without causing pattern damage.

Innovation Solution

A multi-electrode chuck is used with alternating current (AC) voltages that have a phase shift between electrode bias waves to create an electric field that loosens and moves particles off the substrate surface, reducing attractive forces and preventing damage to the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If physical or chemical techniques are used to remove particles from substrate surfaces, then particle removal effectiveness is improved, but underlying layers and patterns may be damaged

Engineering Contradiction:

Improveparticle removal effectivenessVSAvoiddamage to underlying layers and patterns

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent replaces mechanical or chemical particle removal techniques with an electrostatic field-based method. Multiple electrodes generate electrostatic forces that lift and remove particles from the substrate surface without physical contact, thereby avoiding damage to underlying layers and patterns while maintaining effective particle removal

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent applies electrostatic fields with controlled parameters (voltage, frequency, electrode configuration) to selectively interact with particles based on their electrical properties. By adjusting the electrostatic field parameters, the system can remove particles of different sizes and compositions without affecting the substrate's underlying structures

Inventive Principle:

Principle #35Parameter changes

2Productivity

If strong forces are applied to remove particles from substrate surfaces, then particle removal effectiveness is improved, but substrate damage increases

Engineering Contradiction:

Improveparticle removal effectivenessVSAvoidsubstrate integrity

Core Design Contradiction:

ProductivityVSStrength

Solution Approach 1:

The patent substitutes mechanical force application with electrostatic field interaction. The electrostatic forces generated by multiple electrodes can be precisely controlled and adjusted to match particle properties, enabling effective particle removal with forces that are sufficient to lift particles but insufficient to damage the substrate's underlying layers and patterns

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method allows for the effective removal of particles from substrate surfaces without damaging the underlying layers or patterns, making it suitable for use in various semiconductor processing steps, including deposition, etch, and implant processes.

Implementation Method 1

The electrodes of the chuck are biased with alternating current (AC) voltages with a phase shift between the electrode bias waves. The resulting electric field wave on the substrate surface loosens the particles by polarizing the particles

Methodology Applied

Scientific EffectElectrostatic induction: Electrostatic Induction

Implementation Method 2

The resulting electric field wave on the substrate surface loosens the particles by polarizing the particles and moves the loosened particles across the substrate

Methodology Applied

Scientific EffectDielectrophoresis:

Implementation Method 3

The plurality of voltages being alternating voltages, the plurality of voltages including a plurality of different voltage signals, the plurality of different voltage signals being phase shifted from each other. The resulting electric field wave on the substrate surface loosens the particles by polarizing the particles and moves the loosened particles across the substrate

Methodology Applied

Scientific EffectElectrostatic force: Electrostatics

Data Source

PatentUS11376640B2Apparatus and method to electrostatically remove foreign matter from substrate surfaces

Publication Date: 2022.07.05 TOKYO ELECTRON LTD

AI summary

In one exemplary embodiment, described herein are innovative techniques for reducing the attractive force between particles and a substrate surface to aid in the removal of particles from the substrate surface. More specifically, a multi-electrode chuck is utilized to assist in cleaning a substrate. The multi-electrode chuck is utilized to reduce the attractive forces between particles and the substrate and to move the loosened particles that are present on the substrate surface. The electrodes of the chuck are biased with alternating current (AC) voltages with a phase shift between the electrode bias waves. The resulting electric field wave on the substrate surface loosens the particles by polarizing the particles and moves the loosened particles across the substrate.