Multi-Electrode Plasma Chamber Layout for Uniform Substrate Processing
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Solution Overview
Problem
Current plasma processing apparatuses face challenges in achieving uniform plasma processing across substrates due to non-uniform electric field distributions, which affect the consistency and efficiency of processes like etching and film formation.
Innovation Solution
The apparatus features a configuration with multiple electrodes arranged circumferentially around a processing container, with variable radio-frequency power supply settings to control the electric field intensity, allowing for capacitively coupled plasma generation and substrate rotation for improved uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single electrode configuration is used, then the device complexity is low, but the plasma processing uniformity across substrates deteriorates
Solution Approach 1:
The electrode system is segmented into multiple independent electrodes (first electrode, second electrode, third electrode) arranged at different positions around the processing chamber. Each electrode can be independently controlled to generate specific electric field patterns, enabling uniform plasma distribution across multiple substrates without requiring a single complex electrode structure.
Solution Approach 2:
Different electrodes are positioned to create locally optimized electric fields for different regions of the processing chamber. The first electrode generates an electric field in a specific direction, while the second and third electrodes provide complementary field distributions, ensuring that each substrate receives appropriate plasma exposure tailored to its position.
2Manufacturing precision
If multiple electrodes with variable power supply are used, then the plasma processing uniformity is improved, but the device complexity increases
Solution Approach 1:
The power supply system is designed to dynamically adjust the radio frequency power supplied to each electrode independently. This dynamic control capability allows the system to optimize electric field distribution in real-time, adapting to different processing requirements and substrate configurations, thereby improving plasma uniformity while maintaining manageable system complexity through programmable control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables adjustable electric field intensity distribution, enhancing the uniformity of plasma processing across substrates, thereby improving the consistency and efficiency of processes such as etching and film formation.
Implementation Method 1
a radio-frequency power supply that applies a radio-frequency power to the plurality of electrodes, and generates capacitively coupled plasma in the processing container
Data Source
AI summary
A plasma processing apparatus includes: a processing container; a substrate holding unit that disposes a plurality of substrates in multiple tiers and is inserted into the processing container; a rotary shaft that rotates the substrate holding unit; a gas supply unit that supplies a processing gas into the processing container; an exhaust unit that exhausts the inside of the processing container; a plurality of electrodes disposed on the outer side of the processing container and arranged in the circumferential direction of the processing container; and a radio-frequency power supply that applies a radio-frequency power to the plurality of electrodes, thereby generating capacitively coupled plasma in the processing container.