Multi-Emitter Optoelectronic Package for Different Virtual Focal Points
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Solution Overview
Problem
Existing optoelectronic devices with multiple emission regions require complex manufacturing processes to achieve different virtual focal points, resulting in low precision and increased effort.
Innovation Solution
An optoelectronic device with emission regions arranged in a common emitter plane, where each region has a radiation-transmissive body forming the radiation exit surface, allowing for precise adjustment of optical path lengths and virtual focal points without mechanical movement, enabling independent control of emission regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If different surface emitters are placed at different levels in a package to achieve different virtual focal points, then multiple emission regions with different focal points are obtained, but manufacturing effort increases and precision decreases
Solution Approach 1:
A common package structure serves as an intermediary carrier that integrates multiple surface emitters at different levels. This package includes a first carrier region for a first surface emitter and a second carrier region for a second surface emitter, with the second carrier region positioned at a different height than the first. The package structure enables precise positioning of multiple emitters with different virtual focal points while simplifying the manufacturing process through a unified mounting platform.
Solution Approach 2:
The patent implements a nested structure where the second surface emitter is positioned within the vertical space above or below the first surface emitter in the same package. The first and second carrier regions are nested within the same package body, allowing compact arrangement of multiple emission regions with different focal points without requiring separate packages or complex assembly procedures.
2Manufacturing precision
If multiple surface emitters are placed at different levels to achieve different virtual focal points, then emission regions with different focal points are obtained, but manufacturing reliability decreases
Solution Approach 1:
The common package structure acts as a reliable intermediary that pre-establishes precise mechanical and electrical connections for multiple surface emitters. The package includes dedicated carrier regions with integrated bonding pads and contact structures, ensuring reliable electrical connectivity and mechanical stability for each emitter before they are mounted. This pre-integrated approach reduces assembly complexity and improves manufacturing yield.
Solution Approach 2:
Multiple emission regions with different virtual focal points are merged into a single integrated package rather than using separate packages. The first and second surface emitters are combined within one package structure with unified housing, bonding pads, and electrical connections. This consolidation reduces the number of assembly steps, minimizes alignment errors, and improves overall manufacturing reliability while maintaining precise focal point control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for easy and reliable manufacturing of optoelectronic devices with emission regions having different focal points, improving precision and enabling applications such as three-dimensional sensing and illumination without the need for mechanical adjustments.
Implementation Method 1
the radiation-transmissive body has a refractive index that differs from a refractive index of a surrounding medium in which the optoelectronic device is arranged
Data Source
AI summary
The invention relates to an optoelectronic device having at least two emission regions and having a radiation exit face, the emission regions each having an active region provided to generate radiation, the active regions of the emission regions being arranged in a common emitter plane. The emission regions are each assigned a portion of the radiation exit face through which portion the radiation emitted by the respective emission region exits, wherein the radiation exit face is formed at least in part by a radiation-permeable body which is arranged on at least one of the emission regions, and wherein the portions of the radiation exit face are arranged at differing distances from the common emitter plane.