Multi-End Effector Robot for Semiconductor Wafer Transfer
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Solution Overview
Problem
Conventional semiconductor substrate transfer robots face challenges in maintaining high throughput due to variations in wafer storage container slot intervals and non-multiple wafer storage configurations, leading to reduced transfer efficiency when empty slots or non-multiple wafer counts are present.
Innovation Solution
A semiconductor substrate transfer apparatus with multiple end effectors, including one for single substrate and another for multiple substrates, is equipped with a controller that dynamically selects the appropriate end effectors based on substrate distribution status, allowing for independent rotation and retraction to optimize wafer transfer efficiency across varying container configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple wafers are transferred all at once by adjusting end effector width to slot interval, then transfer throughput is improved, but device complexity increases due to the need for adjustment mechanisms when slot intervals differ
Solution Approach 1:
The end effector is divided into multiple independent gripping portions instead of using a single adjustable width structure. Each gripping portion can independently hold one wafer, allowing the system to handle different slot intervals without requiring complex adjustment mechanisms while maintaining high transfer throughput.
2Productivity
If dual-arm robot with independent end effectors is used, then throughput is doubled, but device complexity increases due to coordination requirements
Solution Approach 1:
Multiple end effectors are integrated onto a single robot arm instead of using separate dual-arm robots. This merging approach achieves the throughput benefit of parallel operations while reducing the coordination complexity between independent arms through a unified control system.
3Device complexity
If fixed end effector configuration is used, then device complexity is reduced, but adaptability decreases when empty slots or non-multiple wafer counts are present
Solution Approach 1:
The end effector employs a dynamic configuration where multiple gripping portions can independently rotate and retract based on real-time detection of wafer distribution status. This allows the system to adapt to various slot configurations including empty slots and non-multiple wafer counts without increasing structural complexity.
Data Source
AI summary
A semiconductor substrate transfer apparatus for transferring semiconductor substrates from a first container to a second container, includes: multiple end effectors; at least one robot arm with which the multiple end effectors are independently rotatably joined; and a controller storing software including instructions to judge which end effector or end effectors in the multiple end effectors are to be selected based on a distribution status of substrates stored in the first and second containers and to rotate the selected end effector(s) for unloading a substrate or substrates from the first container and loading the substrate or substrates to the second container.