Multi-Flip Die Sorter Layout for Same-Carrier Die Reorientation
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Solution Overview
Problem
Current die sorter tools are inefficient as they require operators to prepare and load large quantities of empty carriers for flipping dies, leading to inefficiencies and potential damage to dies during handling.
Innovation Solution
A multi-flip semiconductor die sorter tool that manipulates dies on the same carrier using multiple lanes and die flip modules, allowing for continuous operation without changing the die positions within the carrier, thereby reducing human handling and increasing throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If current die sorter tools flip dies from a first carrier to a second empty carrier, then die orientation can be changed, but operators must prepare and load large quantities of empty carriers which reduces efficiency and increases handling complexity
Solution Approach 1:
The patent merges the functions of multiple carriers into a single multi-level carrier structure. The first carrier holds dies in initial orientation while the second carrier (stacked above) holds dies in flipped orientation. This eliminates the need for separate empty carriers and consolidates multiple die sorting operations into one carrier unit, directly resolving the contradiction by improving ease of operation without sacrificing productivity.
Solution Approach 2:
The single multi-level carrier structure serves multiple functions simultaneously: it stores dies in both initial and flipped orientations, acts as both source and destination for die flipping operations, and eliminates the need for separate empty carrier preparation. This multi-functional design directly addresses the contradiction by improving operational ease while maintaining high throughput.
2Device complexity
If current die sorter tools use a single in and single out lane design, then carrier flow is simplified, but the tool cannot continuously operate which reduces productivity
Solution Approach 1:
The patent segments the single lane into multiple functional zones within the same physical lane. The first carrier enters at a first position, dies are manipulated at a second position, and the first carrier exits at a third position. Simultaneously, a second carrier can enter at the first position while the first carrier is being processed. This segmentation allows continuous operation without requiring multiple physical lanes, thus maintaining simplicity while improving productivity.
Solution Approach 2:
The system prepares the second carrier in advance by positioning it to receive the flipped dies before the first carrier has completely exited. This preliminary positioning and timing coordination enables continuous operation without idle time, resolving the contradiction between simple lane configuration and continuous productivity.
3Ease of operation
If operators manually handle and flip dies, then die orientation can be changed, but dies are susceptible to damage during handling
Solution Approach 1:
The patent replaces manual mechanical handling with an automated die manipulation system that uses controlled mechanical arms or robots to flip dies between carriers. This automated system provides precise control over die orientation changes, eliminating the variability and potential damage associated with manual handling while maintaining ease of operation. The system can gently grasp and reorient dies without human force variability, thus improving reliability.
Solution Approach 2:
The patent introduces a controlled intermediary mechanism (automated manipulation system) between the dies and the carriers. This intermediary provides a controlled environment for die flipping, using programmed motion paths and controlled contact points to minimize stress on dies. The intermediary system protects dies from damage while maintaining operational efficiency, resolving the contradiction between ease of operation and die integrity.
4Productivity
If large quantities of empty carriers are prepared and loaded, then die flipping capacity is increased, but operator workload and potential for die damage increase
Solution Approach 1:
The patent combines multiple carrier functions into a single multi-level carrier structure. Instead of managing multiple separate carriers (one for each die batch), the system uses one carrier that can hold and process multiple batches of dies simultaneously. This merging reduces carrier management complexity while maintaining or increasing die flipping capacity, directly resolving the contradiction.
Solution Approach 2:
The multi-level carrier structure performs multiple functions: it serves as both source and destination for die flipping, stores dies in different orientations, and eliminates the need for empty carrier preparation. This universal design increases die flipping capacity without requiring operators to manage large quantities of carriers, thus resolving the contradiction between productivity and complexity.
Data Source
AI summary
A die sorter tool may include a first conveyor, and a first lane to receive, from one or more load ports and via the first conveyor, a carrier with a set of dies. The die sorter tool may include a die flip module to receive the carrier from the first lane, manipulate one or more dies of the set of dies by changing orientations of the one or more dies, and return the one or more dies to the carrier after manipulating the one or more dies and without changing positions of the one or more dies within the carrier. The die sorter tool may include a second conveyor, and a second lane to receive, via the second conveyor, the carrier from the die flip module, and provide, via the first conveyor, the carrier to the one or more load ports.