Multi-Foci Laser Cutting Transparent Substrates
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Solution Overview
Problem
Current methods for cutting transparent and semi-transparent substrates, such as glass, face challenges including variable costs due to consumable materials, labor intensity, and the difficulty in achieving uniform separation edges with laser-based systems, which often require post-processing and are time-consuming.
Innovation Solution
A laser-based cutting system that includes a multi-foci optical system with a beam expander, beam shaper, and multi-zone lens assembly to efficiently and accurately cut substrates by focusing the laser signal to multiple discreet locations, allowing for deterministic separation with reduced post-processing needs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If mechanical drilling and cutting processes are used to manufacture glass substrates, then various geometric features can be formed in the substrate, but consumable materials are required and the processing cost becomes variable and labor intensive
Solution Approach 1:
The patent replaces mechanical drilling and cutting processes with a laser-based optical system. The laser source generates optical signals that are directed through beam directors and lateral distribution devices to create processing areas within the glass substrate, eliminating the need for mechanical consumables like drill bits and cutting blades while reducing labor intensity
2Loss of substance
If a single row of multiple laterally displaced processing areas is formed within the substrate, then laser-based processing can be performed without consumable materials, but the separation line varies from the desired path and the separation edge is less uniform requiring post-processing
Solution Approach 1:
The patent transitions from forming processing areas in a single lateral dimension to forming multiple axially-displaced processing areas along the depth axis of the substrate. The optical system focuses the laser signal at different axial positions to create processing areas at various depths, which when combined produce a more uniform separation edge that requires less post-processing
3Manufacturing precision
If multiple axially-displaced processing areas are formed within the substrate to achieve more uniform separation edge, then post-processing requirements are reduced, but the processing time increases due to sequential focusing
Solution Approach 1:
The patent segments the optical signal into multiple laterally-displaced output signals using a lateral distribution device with multiple beam directors. Each beam director receives the optical signal and directs it to form processing areas at different lateral positions. This parallel segmentation allows multiple processing areas to be formed simultaneously rather than sequentially, maintaining high processing speed while achieving uniform separation edges through the combination of axial and lateral displacement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enables efficient and precise cutting of transparent and semi-transparent substrates with reduced post-processing requirements, achieving uniform edges and minimizing processing time, thereby addressing the limitations of existing methods.
Implementation Method 1
a laser source configured to output an optical signal
Implementation Method 2
focus the optical signal to multiple discreet locations on the substrate
Implementation Method 3
at least one beam expander that is configured to collimate and/or expand diameter of the optical signal
Implementation Method 4
expand diameter of the optical signal
Implementation Method 5
at least one beam shaper configured to generate a high resolution uniform power distribution optical signal
Implementation Method 6
the optical system is configured to output a multi-zone optical signal configured to form multiple axially-displaced processing areas within the substrate
Data Source
AI summary
Disclosed is a system for efficiently cutting a transparent substrate. The system includes a laser source in optical communication with at least one multi-foci optical system. The laser source outputs at least one optical signal to the optical system. The optical system is positioned between the laser source and the substrate to be cut. The optical system includes at least one housing detachably coupled to at least one base member. One or more plate members having one or more apertures formed therein may be coupled to at least one of the housing, the baser member, or both. The aperture formed on the plate member may be configured to permit the optical signal to enter and exit the optical system. Various optical subassemblies may be positioned within or coupled to the optical system.