Multi-Ground Electrode Plasma Control for Thin Film Uniformity
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Solution Overview
Problem
As substrate sizes increase, localized variations in plasma density lead to non-uniform thin film properties and thickness uniformity issues at the center and edge portions, due to plasma density non-uniformity.
Innovation Solution
A substrate processing apparatus with a power supply unit, processing unit, and substrate support unit featuring multiple ground electrodes, including a disk-shaped and ring-shaped electrode configuration, connected to an L-C circuit for independent plasma intensity control, which adjusts plasma density and intensity through parameter control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If substrate size is increased, then processing capacity is improved, but plasma density uniformity deteriorates
Solution Approach 1:
The substrate support unit is divided into multiple independent ground electrodes (first ground electrode and second ground electrode) that can be controlled separately. This segmentation allows independent plasma intensity control at different substrate regions (center and edge portions), enabling uniform thin film deposition across large substrates by compensating for localized plasma density variations.
2Device complexity
If single ground electrode configuration is used, then device complexity is reduced, but plasma intensity control precision deteriorates
Solution Approach 1:
The single ground electrode is segmented into multiple independent ground electrodes (first and second ground electrodes) positioned at different locations. Each electrode can be independently controlled through separate plasma intensity controllers, enabling precise local plasma density adjustment to achieve uniform plasma distribution across the substrate.
Solution Approach 2:
Different regions of the substrate receive customized plasma intensity control through dedicated ground electrodes. The first ground electrode controls plasma at one region while the second ground electrode controls plasma at another region, allowing each area to have optimal plasma density for uniform thin film formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces plasma non-uniformity, improving the uniformity of thin film properties and thickness across the substrate by allowing individual control of plasma at the center and edge regions.
Implementation Method 1
at least one of the first ground electrode and the second ground electrode is connected to an L-C circuit including an inductor, a capacitor, and a variable capacitor
Implementation Method 2
a processing unit, electrically connected to the power supply unit... configured to function as an electrode that supplies power to a reaction space
Data Source
AI summary
A substrate processing apparatus capable of locally controlling a plasma intensity and improving thin film properties and thickness uniformity includes: a power supply unit, a processing unit electrically connected to the power supply unit, and a substrate support unit below the processing unit, wherein the substrate support unit includes a first ground electrode and a second ground electrode.