Multi-heat sink LED device with biasing members
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Solution Overview
Problem
High-power LEDs face significant issues due to heat management, as increased operating temperatures lead to color shift, reduced brightness, lumen degradation, and decreased reliability, primarily due to inefficient heat dissipation.
Innovation Solution
A high-power LED lighting device with a heat sink assembly comprising two heat sink members and biasing members that ensure contact with a housing for effective heat dissipation, maintaining the LEDs within a desired thermal range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If high-power LEDs are used to increase light output, then illumination intensity is improved, but heat generation increases causing color shift and reduced reliability
Solution Approach 1:
The heat dissipation system is segmented into multiple heat sink members (first heat sink member and second heat sink member) that are coupled to different regions of the LED package. This segmentation allows for distributed heat removal from multiple thermal sources, improving overall heat dissipation efficiency while maintaining LED reliability under high illumination conditions
Solution Approach 2:
Heat transfer members serve as intermediaries between the LED package and the heat sink members, facilitating efficient thermal conduction from the LED junction through the package structure to the heat dissipation elements. This intermediary thermal path ensures reliable heat removal while maintaining electrical isolation
2Illumination intensity
If high-power LEDs operate at higher temperatures to increase brightness, then illumination intensity is improved, but color stability deteriorates due to wavelength shift
Solution Approach 1:
The heat sink members are pre-configured with biasing members that apply preliminary thermal contact pressure to ensure optimal thermal coupling between the heat dissipation elements and the housing or mounting structure. This preliminary thermal management action maintains stable LED operating temperature and consistent color output throughout operation
Solution Approach 2:
The system utilizes biasing members that can adjust thermal contact parameters (pressure and contact area) to optimize heat transfer efficiency. By dynamically or statically adjusting these thermal parameters, the LED operating temperature is maintained within a range that preserves color stability while allowing high brightness operation
3Temperature
If heat dissipation structures are added to manage thermal output, then thermal management is improved, but device complexity increases
Solution Approach 1:
The heat sink members serve multiple functions: they provide primary heat dissipation from the LED package, act as structural support elements for mounting the LED assembly, and function as thermal pathways to conduct heat to the housing. This multi-functionality reduces the need for separate dedicated components, thereby limiting complexity increases while improving heat management
Solution Approach 2:
The patent combines the heat dissipation function with existing structural elements of the LED package and housing. The first and second heat sink members are integrated into the overall device structure, sharing space and functional roles with other components, thus adding thermal management capability without proportionally increasing device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat from high-power LEDs, minimizing color shift, lumen degradation, and reliability issues, ensuring consistent light output and extended device lifespan.
Implementation Method 1
Heat from the high-power LED is transferred through the heat sink assembly to the housing, where it is dissipated into the air
Implementation Method 2
at least one biasing members that bias an outer side of the first heat sink member and an outer side of the second heat sink member into contact with an inner side of the housing
Data Source
AI summary
A light emitting diode (LED) lighting device that includes a housing and a heat sink assembly received within the housing. The heat sink assembly includes at least a first heat sink member and at least a second heat sink member. A printed circuit board having at least one LED provided thereon is mounted to both the first heat sink member and the second heat sink member. At least one biasing member biases an outer side of the first heat sink member and an outer side of the second heat sink member into contact with an inner side of the housing. Heat from the at least one LED is transferred through the heat sink assembly to the housing, where it is dissipated into the air.