Multi-Height Die Package Assembly With Planar Heat Sink Contact
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Solution Overview
Problem
The increasing complexity and cost of manufacturing integrated circuit chips with higher density requirements pose challenges, including the difficulty in integrating disparate functional blocks and the need for extensive interconnects between multiple chiplets, which leads to issues like longer signal routing paths, higher power consumption, and varying voltage and timing requirements, making existing solutions impractical for achieving finer pitches and meeting performance, design, and cost constraints.
Innovation Solution
The integration of multiple integrated circuit dice or chip modules onto a multi-chip package substrate with embedded active and/or passive components, using techniques such as microbumps, solder balls, or thermal conductive layers to form interconnects and attach a heat sink lid/cover for thermal management, while addressing warpage issues through localized solder extensions or magnetic stiffener rings to ensure proper electrical and thermal contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple chiplets are connected into a single semiconductor package substrate, then yield and performance are improved, but device complexity and interconnect complications increase
Solution Approach 1:
The invention divides the semiconductor system into multiple independent chiplets (compute chiplet, memory chiplet, I/O chiplet) that can be separately manufactured, tested, and then assembled on a common interposer substrate. This segmentation allows individual testing of each chiplet before assembly, improving yield by identifying defective units early, while the modular structure manages complexity through standardized interconnect interfaces.
Solution Approach 2:
The invention introduces a common interposer substrate as an intermediary component that facilitates connections between multiple chiplets with different voltage, timing, and protocol requirements. The interposer provides standardized ball grid array (BGA) interconnect interfaces that mediate the complex interactions between disparate chiplet types, simplifying the overall system integration while maintaining the benefits of multi-chiplet architecture.
2Adaptability or versatility
If multiple chiplets are integrated into a single package, then functionality is improved, but signal routing path length increases causing higher losses
Solution Approach 1:
The invention transitions from traditional planar chip layouts to a three-dimensional stacked arrangement on a common interposer substrate. Multiple chiplets are positioned at different vertical levels and connected through vertical BGA interconnects, reducing lateral signal routing distances and minimizing signal loss while enabling enhanced functionality through compact spatial arrangement.
3Quantity of substance
If disparate functional blocks are integrated on a single chip, then device density is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The invention segments the semiconductor system into multiple specialized chiplets (compute, memory, I/O) that can be manufactured using different process nodes and technologies optimized for each function, then integrates them on a common interposer substrate. This approach achieves high device density while reducing manufacturing complexity by allowing independent optimization of each chiplet's fabrication process.
Solution Approach 2:
The invention applies local quality by allowing different chiplets to be manufactured with different specifications (transistor nodes, backend interconnect schemes) tailored to their specific functional requirements, while the common interposer substrate provides a standardized platform for integration. This enables each region of the system to have optimized characteristics without compromising overall manufacturability.
4Adaptability or versatility
If chiplets with different specifications are combined, then adaptability is improved, but interconnect requirements become more complex
Solution Approach 1:
The invention implements universality through a common interposer substrate that provides standardized BGA interconnect interfaces capable of supporting multiple chiplet types with different voltage, timing, and protocol requirements. The interposer acts as a universal platform that can accommodate various chiplet specifications while maintaining consistent connection methodologies, thereby managing interconnect complexity through standardization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of functional System-in-Package (SiP) assemblies that improve yield and performance by allowing for the combination of different IC chips with varying dimensions and heat dissipation requirements, while maintaining thermal efficiency and reducing the risk of defects, thus overcoming the limitations of traditional single-chip solutions.
Implementation Method 1
a heat sink lid/cover formed on and thermally connected to the encapsulated integrated circuit dice/chip modules
Implementation Method 2
addressing warpage issues through localized solder extensions or magnetic stiffener rings
Data Source
AI summary
A method and apparatus are provided for manufacturing a packaged assembly by attaching a plurality of multi-height integrated circuit components to an carrier or package substrate with embedded active and/or passive circuit elements and then forming an encapsulating molding compound to cover the multi-height integrated circuit components and then etching or grinding the encapsulating molding compound to expose each of the integrated circuit components at a planar heat dissipation surface so that a heat sink lid/cover can be formed with one or more thermal conductive layers to contact each of the exposed integrated circuit components, thereby enabling removal of heat from the integrated circuit components and the embedded active and/or passive circuit elements of the package substrate.