Multi-Height Molded Semiconductor Assembly With Conductive Backside Layer

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Solution Overview

Problem

Existing semiconductor assembly processes face challenges in efficiently integrating components with varying thicknesses and requiring improved heat dissipation, electrical performance, and structural reinforcement while maintaining precise alignment and electrical connectivity.

Innovation Solution

A method involving the formation of conductive backside material over encapsulated semiconductor components, which includes disposing an encapsulant around multiple surfaces and forming a conductive backside material on the backside of components to enhance heat dissipation, electrical conductivity, and structural support, while allowing for precise alignment and electrical connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If components with varying thicknesses are integrated in a semiconductor assembly, then the assembly can accommodate different component requirements and improve design flexibility, but achieving precise alignment and maintaining structural integrity becomes more difficult

Engineering Contradiction:

Improvecomponent integration flexibilityVSAvoidalignment precision

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent applies segmentation by dividing the assembly process into distinct stages: first placing thicker components and establishing reference alignment features, then using those features as benchmarks for positioning thinner components. This segmented approach to multi-height component integration enables precise alignment despite thickness variations.

Inventive Principle:

Principle #1Segmentation

2Temperature

If backside conductive material is added to semiconductor components, then heat dissipation and electrical performance are improved, but the manufacturing process complexity and number of process steps increase

Engineering Contradiction:

Improveheat dissipationVSAvoidmanufacturing process complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent merges multiple functions into the backside conductive material layer: it simultaneously provides thermal conduction pathways for heat dissipation, electrical conduction for signal/power distribution, and mechanical reinforcement for structural integrity. This consolidation improves heat dissipation and electrical performance while reducing the need for separate dedicated structures for each function.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The backside conductive material serves multiple purposes within the semiconductor assembly: it acts as a heat sink for thermal management, provides electrical connectivity for power and ground paths, offers mechanical support for structural strength, and can serve as an EMI shielding layer. This multi-functionality addresses heat dissipation needs while avoiding the complexity of adding separate dedicated components for each function.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Strength

If encapsulant is disposed around multiple surfaces of components, then structural reinforcement and protection are improved, but access to backside surfaces for conducting material deposition becomes more difficult

Engineering Contradiction:

Improvestructural reinforcementVSAvoidaccessibility for material deposition

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The patent applies preliminary action by depositing the conductive backside material onto component surfaces before the encapsulant is fully cured or while access is still available. This timing strategy ensures that material deposition can be completed on multi-surface encapsulated components without requiring subsequent complex access operations, thus maintaining ease of manufacture while achieving structural reinforcement.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method improves heat dissipation, electrical performance, and structural reinforcement of semiconductor assemblies by providing a conductive backside material that enhances thermal and electrical conductivity, while maintaining precise alignment and electrical connectivity between components.

Implementation Method 1

The conductive backside material provides one or more benefits to the first component or the second component, including heat dissipation, heat conduction

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The conductive backside material provides one or more benefits to the first component or the second component, including shielding, power, ground, electrical performance, electrical contact, electrical conduction

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS20250273526A1Fully molded structure with multi-height components comprising backside conductive material and method for making the same

Publication Date: 2025.08.28 DECA TECH USA INC

AI summary

The disclosure concerns devices and methods of forming an electronic assembly or semiconductor assembly, such as fully molded structures, comprising at least two components of a same or differing heights, which may further comprise a backside conductive material. The backside conductive material may be a good thermal conductor, a good electrical conductor, or both.