Embedded Multi-Height Conductive Tracks for Low-Loss Component Carriers
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Solution Overview
Problem
Existing component carriers face challenges in balancing mechanical robustness, electrical reliability, and high-frequency signal compatibility while requiring complex manufacturing processes and additional assembly steps.
Innovation Solution
A component carrier design featuring electrically conductive tracks of varying heights embedded within dielectric material, allowing for high-density wiring and simultaneous high-speed signal transmission without the need for low-loss materials, achieved through a simple manufacturing process involving stacked track constituents and selective deposition techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional planar tracks are used in component carriers, then manufacturing is simple, but signal loss increases and thermal management becomes inefficient for high-frequency applications
Solution Approach 1:
The patent transitions from conventional two-dimensional planar tracks to three-dimensional vertically extended tracks. The conductive tracks protrude from the planar surface into the insulating layer, creating a vertical component that increases the effective conductor cross-section. This dimensional change reduces signal loss by providing additional conduction paths while maintaining manufacturing simplicity through a single-layer structure.
Solution Approach 2:
The invention combines conductive material (copper or copper alloy) with insulating material (epoxy resin or similar) to create a composite track structure. The conductive tracks are embedded within or protrude through the insulating layer, forming a composite structure that simultaneously provides electrical conduction, mechanical support, and thermal management capabilities.
2Loss of energy
If multiple layer structures are added to reduce signal loss, then signal transmission improves, but manufacturing complexity and cost increase
Solution Approach 1:
Instead of adding multiple horizontal layers to reduce signal loss, the invention adds vertical height to the tracks within a single layer. The tracks protrude upward from the planar surface into the insulating layer, effectively increasing the conductor cross-section without requiring additional lamination steps or complex multi-layer alignment.
Solution Approach 2:
The invention merges the functions of multiple thin conductive layers into a single thick protruding track. Rather than stacking multiple copper layers horizontally, the solution consolidates the conductive material into vertically extending tracks that achieve the same or better signal transmission performance with simpler manufacturing.
3Power
If track height is increased to improve current carrying capacity and heat removal, then electrical performance improves, but manufacturing precision requirements increase
Solution Approach 1:
The protruding track structure is self-forming during the standard PCB manufacturing process. The conductive material is deposited or formed to naturally protrude from the planar surface, and the insulating layer is then applied over it. The structure self-regulates its height based on the deposition or lamination process parameters, reducing the need for precise external control mechanisms.
Solution Approach 2:
The invention changes the geometric parameter of the tracks from purely planar (2D) to vertically extended (3D). By controlling the protrusion height as a key parameter, the design optimizes current carrying capacity and heat dissipation. The height can be adjusted within a reasonable range without fundamentally changing the manufacturing process, providing flexibility in tuning electrical performance.
4Area of moving object
If compact design is pursued with smaller spacing between contacts, then device density increases, but mechanical robustness and electrical reliability decrease
Solution Approach 1:
The invention uses vertical extension of tracks to compensate for reduced horizontal spacing. When contacts are placed closer together horizontally, the tracks extend vertically to maintain sufficient cross-sectional area for current carrying and mechanical strength. This vertical dimension provides a buffer that maintains reliability even when horizontal pitch is reduced.
Solution Approach 2:
The composite structure of protruding conductive tracks embedded in insulating material provides both mechanical robustness and electrical reliability. The insulating layer protects the closely spaced tracks from mechanical damage and environmental factors, while the extended conductive paths ensure reliable electrical connections even at reduced pitch.
Data Source
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AI summary
Component carrier (100) comprising a stack (102) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure (106), at least one first electrically conductive track (108) extending from a vertical level (110) defined by one of the layer structures (104, 106) up to a first height (h1), at least one second electrically conductive track (112) extending from the vertical level (110) defined by the one of the layer structures (104, 106) up to a second height (h2) being larger than the first height (h1), and at least one further electrically insulating layer structure (122) in which the at least one first electrically conductive track (108) and the at least one second electrically conductive track (112) are embedded.