Multi-Helical Coil Layout Without Layer Stacking Leakage

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Solution Overview

Problem

Existing thin-film coil parts face issues with reduced productivity due to multiple layer formation processes, internal terminal placement difficulties, and potential leakage currents, which affect electromagnetic performance.

Innovation Solution

A coil apparatus with multiple coil patterns formed on a single surface in a multi-helical structure, where patterns are spaced apart and connected via vias, allowing for efficient electrical connections and reduced layer stacking.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Force

If the coil pattern is formed in multiple layers to secure sufficient electromagnetic force, then the electromagnetic force is improved, but the productivity is reduced due to additional processes

Engineering Contradiction:
Improveelectromagnetic forceVSAvoidproductivity
Core Design Contradiction:
ForceVSProductivity

Solution Approach 1:

The patent transitions from vertical stacking (multiple layers) to horizontal arrangement (multiple patterns on one surface). Multiple coil patterns are formed side-by-side on a single substrate surface, spaced apart in parallel, eliminating the need for interlayer insulating layers and via holes between layers while maintaining sufficient electromagnetic force through increased lateral coverage.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Force

If the coil pattern is formed in multiple layers, then the electromagnetic force is improved, but the device complexity increases due to interlayer insulating layer formation, via hole formation, and deposition film formation

Engineering Contradiction:
Improveelectromagnetic forceVSAvoiddevice complexity
Core Design Contradiction:
ForceVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the intermediate layers (interlayer insulating layers and via holes) from the multi-layer structure. By forming all coil patterns on a single substrate surface, the complex stacking processes including insulating layer deposition, via hole formation, and multiple deposition steps are removed, significantly reducing device complexity.

Inventive Principle:
Principle #2Taking out (Extraction)

3Force

If the coil pattern is formed in multiple layers, then the electromagnetic force is improved, but leakage current occurs because the interlayer insulating layer may not completely block the current

Engineering Contradiction:
Improveelectromagnetic forceVSAvoidleakage current
Core Design Contradiction:
ForceVSReliability

Solution Approach 1:

The patent avoids the harmful effect of potential leakage currents through interlayer insulating layers by completely eliminating the multi-layer stacking structure. All coil patterns are formed on the same substrate surface with adequate spacing, removing the interface between layers where leakage could occur, thus improving reliability while maintaining electromagnetic performance.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

4Force

If the coil pattern is formed in multiple layers with terminals on the winding core side, then the electromagnetic force is improved, but the ease of operation deteriorates because connections between the coil part and outside power supply become difficult

Engineering Contradiction:
Improveelectromagnetic forceVSAvoidease of operation
Core Design Contradiction:
ForceVSEase of operation

Solution Approach 1:

The patent inverts the terminal placement strategy. Instead of placing terminals on the winding core side (inside) as in conventional multi-layer structures, the coil patterns are arranged on a single surface with terminals accessible on the outer perimeter, making electrical connections to external power supplies straightforward and easy to implement.

Inventive Principle:
Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design secures high electromagnetic force while enhancing circuit freedom and production efficiency by minimizing layer count and preventing leakage currents.

Implementation Method 1

Thin-film coil parts are electronic parts used for noise removal and focus correction in various electronic devices. In order to secure sufficient electromagnetic force

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS12476036B2Coil apparatus
Publication Date: 2025.11.18 STEMCO CO LTD
  • US12476036B2 patent drawing
  • US12476036B2 patent drawing
  • US12476036B2 patent drawing

AI summary

Provided is a coil apparatus having a plurality of coil patterns formed on one surface. The coil apparatus comprises at least one coil substrate, wherein the coil substrate comprises a base layer, and a coil pattern formed on the base layer and including a pattern portion, a via portion part or an external electrode portion, and a coil substrate, wherein the coil substrate is wound in a multi-helical structure in response to a plurality of coil patterns being provided.