Multi-Hole Cooling Device for Slim Electronic Apparatus
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Solution Overview
Problem
The challenge in creating a slim cooling device for electronic apparatuses, such as portable computers, is maintaining structural strength while ensuring efficient heat transfer and coolant flow, as traditional methods often compromise on thickness and rigidity.
Innovation Solution
A cooling device with a heat transfer unit comprising a first and second plate member forming a multi-hole pipe structure, where the first plate member has grooves that correspond to the passage and are closed by the second plate member in a fluid-tight manner, enhancing rigidity and flexibility with ordinary temperature bonding, and a pump and fin configuration that facilitates efficient coolant circulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the passage is made thin to slim down the cooling device, then the overall thickness is reduced, but the strength of the passage is compromised
Solution Approach 1:
The passage is divided into multiple segments by forming partition walls at regular intervals along the length of the passage. These partition walls create multiple smaller passage sections, each maintaining sufficient structural strength while allowing the overall passage thickness to be reduced for slimming down the cooling device.
Solution Approach 2:
The passage structure combines thin-walled sections with strategically positioned partition walls to create a composite structural system. The partition walls act as reinforcement elements that compensate for the reduced thickness of the passage walls, maintaining overall structural integrity while enabling a slimmer design.
2Strength
If a multi-hole pipe with partition walls is used to ensure strength, then the structural strength is maintained, but the device complexity increases
Solution Approach 1:
The passage is segmented into multiple sections by partition walls positioned at regular intervals. This segmentation provides structural reinforcement to maintain strength while using simple, repetitive geometric patterns that do not significantly increase manufacturing complexity.
Solution Approach 2:
The partition walls are designed with optimized parameters including their positioning at regular intervals, their thickness relative to the passage wall thickness, and their extension depth within the passage. These parameter optimizations ensure structural strength is achieved while keeping the design simple and manufacturable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for effective heat transfer and coolant circulation, maintaining the slim design while ensuring the structural integrity and efficiency of the cooling device, enabling the portable computer to be slimmed down without compromising cooling performance.
Implementation Method 1
a heat-receiving section thermally connected to a heating element
Implementation Method 2
a heat-sinking section for dissipating heat received by the heat-receiving section
Data Source
AI summary
According to one embodiment, a cooling device includes: a heat transfer unit including a passage, through which a coolant circulates; a heat-receiving section thermally connected to a heating element; and a heat-sinking section for dissipating heat received by the heat-receiving section. The heat transfer unit includes: a first plate member, in which a groove corresponding to the passage is formed; and a second plate member, which covers the groove. The heat-receiving section is formed on one of the first and second plate members.