Multi-host Interface Controller with Integrated USB PHY and Analog Functions
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Solution Overview
Problem
Conventional memory devices face challenges in efficiently integrating multiple interfaces and managing heat dissipation, leading to increased manufacturing costs and potential signal interference, especially when incorporating USB functionality.
Innovation Solution
The solution involves separating the USB PHY and analog circuitry from the controller and memory array onto different IC dies, using multi-chip packaging and wire bonding, allowing for independent modification and improved thermal performance, while utilizing the 12 signal UTMI+Low Pin Count interface to support multiple operation modes with minimal additional signal pins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If USB PHY and analog circuitry are integrated into the controller IC die, then device functionality is improved, but heat dissipation increases and signal interference occurs
Solution Approach 1:
The patent divides the memory device into separate IC dies: one die contains the controller and USB PHY, while another die contains the memory array. This segmentation allows the USB PHY to be isolated from the memory array, reducing signal interference and heat dissipation issues while maintaining full USB functionality.
2Adaptability or versatility
If multiple interfaces are integrated into a single controller IC, then interface versatility is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The controller IC die is designed with a universal interface architecture that can support multiple interface types (USB, SD, MMC, etc.) through a single multi-functional interface block. This allows the controller to communicate with different host devices using different protocols without requiring separate dedicated hardware for each interface type, thereby reducing manufacturing complexity while maintaining versatility.
3Adaptability or versatility
If USB PHY is integrated with the controller, then device capability is improved, but manufacturing cost increases in high volume settings
Solution Approach 1:
By segmenting the USB PHY into a separate IC die that can be independently manufactured and then packaged with the controller die, the patent enables specialized high-volume production of each component. This approach allows manufacturers to optimize the fabrication process for each die type separately and benefit from economies of scale, ultimately reducing per-unit manufacturing costs compared to producing a single integrated chip containing all functions.
Data Source
AI summary
In a first embodiment, an apparatus and a method of fabrication thereof includes a substrate, a controller formed on a first integrated circuit (IC) die and disposed on the substrate, a second IC die embodying circuitry configured to enable communication between the controller and an external device, first I/O pads disposed on the first IC die, second I/O pads disposed on the second IC die, wire bonding interconnections coupling at least one of the first I/O pads with at least one of the second I/O pads, and a memory array formed on a third IC die and configured to enable communication with the controller. In a second embodiment the memory array is alternatively integrated into the first IC die.