Multi IC Chip Carrier Package Alignment and Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current electronic systems face challenges in achieving higher levels of integration and efficient heat management for multi-IC chip carriers, which limits their performance and reliability.
Innovation Solution
A method and system for fabricating a multi-IC chip carrier package that involves positioning a multi-IC chip carrier with alignment protrusions on a carrier deck, aligning a lid with alignment receptacles, connecting the lid to the carrier and each IC chip, and removing the carrier from the deck, using thermal interface material and seal band material to enhance thermal coupling and mechanical support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple IC chips are integrated on a single carrier to improve system performance, then integration level increases, but heat management becomes more difficult and reliability decreases
Solution Approach 1:
The patent divides the multi-IC chip carrier into separable components: a carrier deck that can be removed after assembly, and a permanent lid that remains with the IC chips. This segmentation allows the carrier deck to provide temporary support during manufacturing while the lid provides permanent thermal and mechanical support for heat management.
Solution Approach 2:
The patent introduces a lid as an intermediary component between the IC chips and the external environment. This lid serves as a thermal management interface that can be connected to heat sinks or cooling systems, directly addressing the heat management challenge of multi-IC configurations.
2Manufacturing precision
If alignment protrusions and receptacles are used to ensure precise alignment, then manufacturing precision improves, but device complexity increases
Solution Approach 1:
The alignment protrusions and receptacles are pre-formed features built into the carrier deck and lid structures. This preliminary preparation of alignment features simplifies the assembly process, as the components self-align during assembly without requiring complex alignment procedures or additional adjustment steps.
Solution Approach 2:
The alignment protrusions and receptacles create a self-aligning mechanism where the geometry of the features themselves performs the alignment function. The components guide each other into proper position through their own structural features, eliminating the need for external alignment tools or complex positioning systems.
Data Source
AI summary
A multi integrated circuit (IC) chip package includes multiple IC chips, a carrier, and a lid. The IC chips may be connected to the carrier. Alternatively, each IC chip may be connected to an interposer and multiple interposers may be connected to the carrier. The carrier may be positioned within a carrier deck. The lid may be positioned relative to carrier by aligning one or more alignment receptacles within the lid with one or more respective alignment protrusions of the carrier deck. A compression fixture cover may contact the lid and exert a force toward the carrier deck, respective lid pedestals may be loaded toward respective IC chips, and an integral lid foot may be loaded toward the carrier. While under compression, thermal interface material between respective lid pedestals and respective IC chips and seal band material between the integral foot and the carrier may be cured.