Multi-Inlet Heatsink Structure for High-Flux CPU Cooling
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Solution Overview
Problem
Conventional heat exchangers, including heatsinks and fans, struggle to dissipate the high heat generated by modern computer processors effectively, leading to performance limitations and noise issues, while traditional liquid heat sinks may face dimension and noise constraints.
Innovation Solution
A heatsink device with a base plate and a heat exchanger that includes a fluid chamber with inclined inlet passageways and a medial plate, promoting fluid flow and turbulence to enhance thermal conductivity, coupled with a radiator system for improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If fans and heatsinks are increased in size and surface area to dissipate heat, then heat dissipation capability is improved, but noise and dimension constraints worsen
Solution Approach 1:
The patent replaces conventional air-based cooling with liquid cooling, using a pump to force liquid through inlet passageways in the heatsink device. This hydraulic approach enables more efficient heat removal per unit volume, allowing smaller heatsink dimensions and reduced fan requirements while maintaining effective heat dissipation and lowering noise levels.
Solution Approach 2:
The invention changes the cooling medium from air to liquid, fundamentally altering the thermal conductivity parameter. Liquid coolant provides superior heat transfer coefficients compared to air, enabling compact heatsink designs that achieve high heat dissipation without increasing size or noise.
2Device complexity
If a single inlet fluid line is used in conventional liquid heat sinks, then device complexity is reduced, but heat dissipation effectiveness and fluid flow distribution worsen
Solution Approach 1:
The patent divides the single inlet into multiple inlet passageways (first inlet passageway and second inlet passageway) that distribute liquid coolant to different regions of the heatsink device. This segmentation improves fluid flow distribution across the heat exchanger surfaces, enhancing overall heat dissipation effectiveness while maintaining manageable device complexity.
Solution Approach 2:
The multiple inlet passageways provide different flow rates and distributions to specific regions of the heatsink, optimizing local heat removal where needed. This localized fluid distribution ensures uniform temperature fields and maximizes heat transfer efficiency in high-heat-generation areas.
3Adaptability or versatility
If conventional heat exchangers are used with high transistor density processors, then compatibility is maintained, but heat dissipation capability and performance worsen
Solution Approach 1:
The patent employs liquid coolant instead of air, fundamentally changing the thermal conductivity parameter of the cooling medium. This enables the heatsink device to handle the high heat flux from modern high-transistor-density processors that conventional air-based heat exchangers cannot effectively dissipate.
Solution Approach 2:
By implementing a liquid cooling system with pump-driven flow through multiple inlet passageways, the invention achieves superior heat transfer coefficients compared to conventional air cooling, enabling compatibility with high-power processors while maintaining effective heat dissipation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively removes 15×10^6 W/m³ of thermal energy from a CPU, outperforming conventional heat sinks with a single inlet fluid line, while maintaining a uniform temperature field and reducing noise and dimension constraints.
Implementation Method 1
A heatsink device with a base plate and a heat exchanger that includes a fluid chamber with inclined inlet passageways and a medial plate, promoting fluid flow and turbulence to enhance thermal conductivity
Implementation Method 2
A heatsink device with a base plate and a heat exchanger that includes a fluid chamber with inclined inlet passageways and a medial plate, promoting fluid flow and turbulence to enhance thermal conductivity
Implementation Method 3
coupled with a radiator system for improved heat dissipation
Data Source
AI summary
A heatsink device is for an electronic component. The heatsink device may include a base plate having a body, and legs extending laterally outward from the body, and defining an opening within the body, and a heat exchanger. The heat exchanger may include a lower body under the base plate and abutting the electronic component, an upper body coupled to the lower body to define a fluid chamber therein, and a medial plate between the lower body and the upper body and having first and second slots therein. The upper body may define first and second inlet passageways respectively aligned with the first and second slots, and an outlet passageway for fluid in the fluid chamber. The first and second slots may be configured to cause the fluid to flow laterally within the fluid chamber.