Shared-Contact Multi-Interface Memory for Host Compatibility

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Solution Overview

Problem

The increasing cost of the controller plus package assembly in non-volatile memory technology, which does not scale down with advancements, necessitates higher prices for host systems and reduced profits for manufacturers, while previous cost reduction methods often compromise performance or compatibility with existing host systems.

Innovation Solution

A multi-interface memory package with multiple host interfaces that follow existing standards, allowing hosts to utilize different interfaces for performance and bootability benefits, and multiplexing signals to reduce contact requirements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple host interfaces are integrated into a single memory package, then compatibility and performance benefits are improved, but device complexity increases

Engineering Contradiction:
Improveinterface compatibilityVSAvoidpackage complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The memory package incorporates multiple host interfaces (first host interface and second host interface) within a single package, enabling the package to communicate with different types of host systems through different interface standards. This multi-functionality approach allows one package to serve multiple purposes and兼容 different host architectures without requiring separate packages for each interface type.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent combines multiple host interfaces and memory devices into a single integrated package. The first host interface is coupled to a first memory device, the second host interface is coupled to a second memory device, and both interfaces share common contacts on the package substrate. This merging reduces the number of separate components and simplifies system integration.

Inventive Principle:
Principle #5Merging (Combining)

2Quantity of substance

If signal multiplexing is implemented to reduce contact requirements, then contact quantity is reduced, but signal interference risk increases

Engineering Contradiction:
Improvecontact quantityVSAvoidsignal integrity
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

Certain contacts on the package substrate are designed to be shared by multiple host interfaces. For example, a first set of contacts is shared by both the first host interface and the second host interface, allowing these contacts to carry signals for multiple different interface protocols. This reduces the total number of contacts required while maintaining full functionality of both interfaces.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The package employs dynamic signal routing where the function of each contact can change depending on which host interface is active. The host interface circuitry can dynamically configure which contacts are assigned to which interface based on the operational mode, allowing flexible allocation of contact resources and reducing the need for dedicated contacts for each interface.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS12475068B2Multi-interface memory
Publication Date: 2025.11.18 MICRON TECHNOLOGY INC
  • US12475068B2 patent drawing
  • US12475068B2 patent drawing
  • US12475068B2 patent drawing

AI summary

A multi-interface memory can include a memory package that includes a memory device and host interfaces coupled to the memory device. Each of the host interfaces is configured to operate according to a different protocol. The memory package can be coupled to a host via one or more of the host interfaces. More than one of the host interfaces can share a contact.