Multi-Interposer Quantum Chip Structure for Cooling and Coherence

The patent divides the interposer into multiple separate interposers (first interposer, second interposer, third interposer) with distinct functions. The first interposer provides cooling contact with the sample table, while the second and third interposers provide terminal wiring layers on their upper surfaces. This segmentation allows simultaneous achievement of cooling and increased terminal count without conflict.

The patent transitions from a single-plane interposer structure to a multi-layer stacked structure extending in the vertical dimension. Multiple interposers are stacked with wiring layers distributed across different heights, allowing terminals to be arranged in three-dimensional space rather than confined to a single surface plane, thereby increasing terminal capacity while maintaining cooling functionality.

The patent removes or minimizes the use of dielectric materials in the wiring layers of interposers that are positioned near the qubit circuit area. By extracting the harmful dielectric component from critical regions, the patent prevents power loss and maintains qubit circuit coherence while still enabling multiple terminals through alternative conductive structures.

The patent applies different material qualities to different regions of the interposer structure. In areas close to the qubit circuit, dielectric materials are excluded or minimized to preserve coherence. In other regions where dielectric exposure does not affect qubit performance, standard wiring structures can be used. This localized quality differentiation resolves the contradiction between terminal count and coherence.