Multi-Interposer Semiconductor Package on a Single Substrate
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Solution Overview
Problem
Semiconductor package designs are constrained by sizing and spacing considerations, leading to complex verification processes and increased costs due to the need for separate substrates and additional components for each die, which complicates system design and interoperability.
Innovation Solution
The use of multiple subassemblies on a single substrate, where each subassembly consists of an interposer and a die, allows for easier verification and reduced complexity by enabling identical simulations across different scenarios, and simplifies system design by minimizing space and reducing the need for additional structures like re-timers and cabling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate substrates are used for each die, then verification processes become more complex and costs increase, but device functionality and reliability are maintained
Solution Approach 1:
The patent combines multiple separate substrate assemblies into a single integrated substrate that can accommodate multiple interposers and dice. This merging approach maintains the functional reliability of each die while eliminating the need for separate verification processes for each individual substrate assembly, thereby reducing overall verification complexity and cost.
Solution Approach 2:
The single substrate is designed to serve multiple functions simultaneously by supporting multiple interposers and dice on the same substrate platform. This universal substrate design allows identical verification simulations to be applied across all dice, reducing the need for multiple specialized verification processes while maintaining device functionality.
2Adaptability or versatility
If additional components like re-timers and cabling are used, then system interoperability is achieved, but space requirements and material costs increase
Solution Approach 1:
The patent merges the functions of multiple separate components (substrates, interposers, connection structures) into a single integrated substrate assembly. This consolidation achieves system interoperability among multiple dice without requiring additional external components like separate re-timers and cabling, thereby reducing space requirements and material costs.
3Reliability
If multiple separate packages are used, then each die is individually protected and connected, but system design complexity and installation costs increase
Solution Approach 1:
The patent combines multiple individual package assemblies into a single integrated substrate structure that provides collective protection for multiple dice. This merging approach maintains the protective function for each die while significantly simplifying system design and reducing installation complexity, as the entire multi-die assembly is treated as a single integrated unit rather than multiple separate packages.
Data Source
AI summary
A semiconductor package can include a unitary substrate defining a first region and a second region. A first interposer can be mounted on the unitary substrate in the first region, and a first die can be mounted on the first interposer. A second interposer can be mounted in the second region on the unitary substrate, and a second die can be mounted on the second interposer.