Multi-junction Solar Cells Using Wafer Bonding and Layer Transfer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The integration of non-lattice-matched materials in multi-junction solar cells is limited by crystal lattice-matching requirements, which restricts the number of subcells that can be integrated and affects the efficiency of solar energy collection.
Innovation Solution
Wafer bonding and layer transfer techniques enable the integration of III-V semiconductors and group IV materials into monolithic structures, allowing for the fabrication of multi-junction solar cells with non-lattice-matched materials, such as InGaAs, GaAs, AlGaAs, and Si, without the need for epitaxy, and the use of flexible substrates for high-performance solar cells.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If epitaxy is used to fabricate multi-junction solar cells, then series connected subcells can be formed, but the number of subcells that can be integrated is limited due to crystal lattice-matching requirements
Solution Approach 1:
The solar cell structure is divided into separate subcells that are independently fabricated on different substrates and then bonded together. This segmentation allows each subcell to be optimized for its specific material system without being constrained by lattice-matching requirements with other subcells, thereby enabling integration of more subcells with diverse band gaps.
Solution Approach 2:
A tunnel junction is introduced as an intermediary element between subcells to enable electrical connection. The tunnel junction serves as a mediator that allows current to pass between subcells with different materials and lattice structures, overcoming the limitation of direct epitaxial growth between mismatched materials.
2Loss of energy
If subcell band gaps are engineered for efficient solar spectrum collection, then high efficiency is achieved, but material integration limitations restrict the number of subcells
Solution Approach 1:
The invention employs composite material structures where multiple semiconductor materials with different band gaps are integrated into a single device. By using bonding techniques rather than epitaxial growth, the patent combines materials like GaInP, GaAs, and Si that would be incompatible in a monolithic epitaxial structure, creating a composite multi-junction cell that captures broader solar spectrum.
3Reliability
If monolithic process is used with heavily doped tunnel junction, then electrical connection between subcells is achieved, but photo-current matching constraints limit design flexibility
Solution Approach 1:
The monolithic structure is segmented into separately fabricated subcells that are bonded together. This allows independent optimization of each subcell's photo-current characteristics before assembly, providing greater design flexibility while maintaining reliable electrical connections through the tunnel junction intermediary.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach expands the possibilities for multi-junction solar cell designs, enhancing efficiency by integrating incompatible materials, reducing material costs, and improving mechanical and thermal properties, while allowing for flexible substrate use, thus overcoming the limitations of traditional epitaxy-based methods.
Implementation Method 1
Wafer bonding and layer transfer enables the integration of otherwise incompatible materials to form novel multi-junction solar cell structures
Implementation Method 2
Multi-junction solar cells consist of two or more p-n junction subcells with band gaps engineered to enable efficient collection of the broad solar spectrum
Data Source
AI summary
A multi-junction solar cell includes an active silicon subcell, a first non-silicon subcell bonded to a first side of the active silicon subcell, and a second non-silicon subcell bonded to a second side of the active silicon subcell. This and other solar cells may be formed by bonding and layer transfer.


