Multi-Laser Photonic Computing Assembly for Beam Alignment and Thermal Control

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Solution Overview

Problem

Existing photonic computing platforms have limited use of optical signals for computing operations, and integrating a multi-laser photonic source with efficient alignment and thermal management remains a challenge.

Innovation Solution

A method for assembling a photonic computing system by attaching a photonic source with multiple laser dies to a support structure, aligning beam-shaping optical elements, and integrating it with a photonic integrated circuit, including thermal management through a heatsink or thermoelectric cooler, to facilitate efficient optical beam coupling and thermal control.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If multiple laser dies are integrated on a single substrate to provide multiple optical beams, then the number of optical channels is increased, but the alignment complexity and thermal management difficulty increase

Engineering Contradiction:
Improvenumber of optical channelsVSAvoidalignment complexity
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

Multiple laser dies are integrated on a single substrate to form a photonic source that provides multiple optical beams simultaneously. This merging approach increases the number of optical channels while maintaining a compact footprint, though it introduces alignment and thermal management challenges that the patent addresses through integrated design solutions.

Inventive Principle:
Principle #5Merging (Combining)

2Volume of moving object

If multiple laser dies are integrated on a single substrate, then system compactness is improved, but thermal management becomes more difficult

Engineering Contradiction:
Improvesystem compactnessVSAvoidthermal management
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

Multiple laser dies are integrated on a single substrate to achieve system compactness. The patent addresses the resulting thermal management challenges through integrated heat dissipation designs that work in conjunction with the compact multi-laser architecture.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If beam-shaping optical elements are aligned during attachment to couple optical beams efficiently, then coupling efficiency is improved, but the manufacturing process complexity increases

Engineering Contradiction:
Improvecoupling efficiencyVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

Beam-shaping optical elements are aligned during the attachment process itself, rather than requiring separate alignment steps. This preliminary alignment action ensures efficient optical beam coupling while integrating the alignment process into the manufacturing flow, though it does increase the complexity of the attachment operation.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient alignment and thermal management of a multi-laser photonic source, providing a large number of optical channels for computing operations with reduced optical path length and system complexity, enhancing performance and scalability.

Implementation Method 1

a first laser die on a substrate configured to provide a first optical beam, and a second laser die on the substrate configured to provide a second optical beam

Methodology Applied
Scientific EffectLaser: Laser

Implementation Method 2

aligning a first beam-shaping optical element during attachment so that the first optical beam is coupled to the first coupler

Methodology Applied
Scientific EffectRefraction: Refraction

Implementation Method 3

thermal management through a heatsink or thermoelectric cooler

Methodology Applied
Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentUS20260056374A1Photonic computing platform
Publication Date: 2026.02.26 LIGHTELLIGENCE PTE LTD
  • US20260056374A1 patent drawing
  • US20260056374A1 patent drawing
  • US20260056374A1 patent drawing

AI summary

A method for assembling a photonic computing system includes attaching a photonic source to a support structure, and attaching a photonic integrated circuit to the support structure. The photonic source includes a first laser die on a substrate configured to provide a first optical beam, and a second laser die on the substrate configured to provide a second optical beam. The photonic integrated circuit includes a first waveguide and a first coupler coupled to the first waveguide, and a second waveguide and a second coupler coupled to the second waveguide. The method includes attaching a plurality of beam-shaping optical elements to the support structure, the substrate, or the photonic integrated circuit, in which the attaching includes aligning a first beam-shaping optical element during attachment so that the first optical beam is coupled to the first coupler, and aligning a second beam-shaping optical element during attachment so that the second optical beam is coupled to the second coupler.