Multi-Layer Antenna Package Layout for Size and Gain Balance
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Solution Overview
Problem
Existing electronic device packaging solutions, such as antenna in package (AiP) and antenna on package (AoP), face challenges in reducing size and increasing integration while supporting higher electronic functionality, particularly in portable devices where size and form factor limitations are a concern.
Innovation Solution
The electronic device incorporates multiple insulating layers with different dielectric constants to support antenna patterns operating at different frequencies, with the higher frequency antenna disposed in a low dielectric constant material to enhance gain and the lower frequency antenna in a high dielectric constant material to reduce dimension, allowing for efficient integration and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If antenna patterns are integrated in a single insulating layer, then device size is reduced, but antenna gain and performance at different frequencies deteriorate
Solution Approach 1:
The patent divides the insulating structure into multiple insulating layers with different dielectric constants, placing different antenna patterns in different layers. This segmentation allows each antenna to operate in an optimized dielectric environment, resolving the contradiction between size reduction and performance maintenance.
Solution Approach 2:
The patent applies local quality by assigning different dielectric constant values to different insulating layers based on the specific frequency and performance requirements of each antenna pattern. High dielectric constant layers are used where dimension reduction is critical, while low dielectric constant layers are used where gain optimization is priority.
2Adaptability or versatility
If multiple antenna patterns operate at different frequencies, then electronic functionality is increased, but device complexity increases
Solution Approach 1:
The patent merges multiple antenna patterns and their respective insulating layers into a single integrated package structure, achieving multi-frequency functionality without proportionally increasing overall device complexity. The layered structure allows simultaneous operation of multiple antennas in a compact arrangement.
Solution Approach 2:
The patent uses composite insulating layer structures with different dielectric constants to support multiple antenna frequencies. This composite approach enables diverse electronic functionality while managing complexity through material differentiation rather than structural complexity.
3Length of moving object
If antenna dimension is reduced for miniaturization, then portability is improved, but antenna gain and radiation performance deteriorate
Solution Approach 1:
The patent changes the dielectric constant parameter of the insulating layers to compensate for antenna dimension reduction. By selecting appropriate dielectric constant values, the patent maintains antenna gain and radiation performance even when physical antenna dimensions are reduced for miniaturization.
Solution Approach 2:
The patent employs composite insulating layers with different dielectric constants to achieve both miniaturization and performance maintenance. The combination of high and low dielectric constant materials allows dimension reduction while preserving antenna gain through optimized electromagnetic field distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables enhanced antenna gain and reduced dimensions, effectively addressing the size and integration challenges in electronic device packaging, particularly in portable devices by optimizing antenna placement within distinct insulating materials.
Implementation Method 1
A dielectric constant of the first insulating layer is different from a dielectric constant of the second insulating layer
Data Source
AI summary
The present disclosure provides an electronic device. The electronic device includes a first insulating layer, a first antenna pattern, a second insulating layer, and a second antenna pattern. The first antenna pattern is configured to operate at a first frequency and at least partially disposed over the first insulating layer. The second insulating layer is disposed over the first insulating layer. The second antenna pattern is configured to operate at a second frequency different from the first frequency and at least partially disposed over the second insulating layer. A dielectric constant of the first insulating layer is different from a dielectric constant of the second insulating layer.