Multi-Layer Bypass Wiring for Transparent Display Regions

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Solution Overview

Problem

In display apparatuses, there is a challenge to minimize the area of non-display regions within the display region to maximize the effective display area, particularly due to the layout of signal wirings around components like cameras, which require bypassing transparent regions without overlapping them.

Innovation Solution

A display apparatus design featuring a first substrate with a display region, a transparent region, and a frame region surrounding the transparent region, where scan and image signal lines are arranged in conductive layers with specific extension and bypass wiring configurations to minimize the frame region's area, allowing for efficient signal transmission while avoiding overlap with the transparent region.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If signal wirings are arranged to bypass the transparent region, then the transparent region can maintain its light transmittance without overlap, but the frame region area increases reducing the effective display area

Engineering Contradiction:
Improvelight transmittance of transparent regionVSAvoidframe region area
Core Design Contradiction:
Illumination intensityVSArea of stationary object

Solution Approach 1:

The patent applies dimensionality change by routing signal wirings through multiple conductive layers (first, second, and third conductive layers) instead of arranging them in a single plane. The bypass wirings in the second and third conductive layers allow signals to traverse the frame region vertically and horizontally, reducing the horizontal spread needed in the frame region while maintaining connectivity to pixels around the transparent region.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent segments the signal wiring path into multiple portions across different conductive layers. Extension wiring portions connect pixels to the transparent region boundary, while bypass wiring portions in the second and third conductive layers route signals around the transparent region. This segmentation allows more efficient use of the frame region space compared to a single-layer bypass approach.

Inventive Principle:
Principle #1Segmentation

2Area of stationary object

If the frame region area is reduced to increase effective display area, then the occupancy of display region increases, but it becomes difficult to arrange signal wirings to bypass the transparent region without overlap

Engineering Contradiction:
Improveeffective display areaVSAvoidsignal wiring arrangement complexity
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent resolves the wiring arrangement complexity by utilizing multiple conductive layers (first, second, and third conductive layers) stacked vertically. This multi-layer approach provides additional routing dimensions, allowing signal wirings to bypass the transparent region more compactly within the frame region without requiring excessive horizontal space or creating complex planar routing patterns.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent merges multiple wiring functions into a coordinated multi-layer structure. Extension wirings in the first conductive layer handle direct pixel connections, while bypass wirings in the second and third conductive layers handle routing around the transparent region. This merging of functions across layers achieves efficient signal transmission with reduced frame region area compared to single-layer designs.

Inventive Principle:
Principle #5Merging (Combining)

3Adaptability or versatility

If transparent region is formed inside display region to accommodate camera, then component integration is improved, but signal wiring layout becomes more complex requiring bypass arrangements

Engineering Contradiction:
Improvecomponent integration capabilityVSAvoidsignal wiring layout complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent addresses the increased wiring layout complexity caused by the transparent region by implementing bypass wirings across multiple conductive layers (second and third conductive layers). This vertical dimensionality allows signal wirings to route around the transparent region more efficiently, reducing the planar complexity that would result from attempting to bypass the region in a single layer while maintaining the camera integration benefit.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS20240329476A1Display apparatus
Publication Date: 2024.10.03 MAGNOLIA WHITE CORP
  • US20240329476A1 patent drawing
  • US20240329476A1 patent drawing
  • US20240329476A1 patent drawing

AI summary

Some of a plurality of image signal lines of a display apparatus according to one embodiment includes: a plurality of bypass wiring portions (bypass wirings) arranged in a frame region so as to have both ends being connected to a plurality of extension wiring portions (extension wirings). The plurality of bypass wiring portions of the plurality of image signal lines include: a plurality of second-layer bypass wirings arranged in a second conductive layer; and a plurality of third-layer bypass wirings arranged in a third conductive layer that is different from a first conductive layer and the second conductive layer. Each of an arrangement pitch between the plurality of second-layer bypass wirings and an arrangement pitch between the plurality of third-layer bypass wirings is smaller than an arrangement pitch between the plurality of image signal lines in a display region.