Multi-layer Capacitor Package with Vertical Electrode Stacking
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Solution Overview
Problem
Multi-layer capacitors face efficiency issues due to reduced electrode areas and potential damage from external forces during voltage application, leading to unreliable voltage supply and coupling with external terminals.
Innovation Solution
A multi-layer capacitor package design with vertically overlapping and horizontally spaced connection electrodes, insulated by an insulating layer, and internal electrodes extending along the package housing to secure maximum electrode areas and ensure reliable voltage supply through external terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the electrode areas are decreased from bottom to top to enable parallel connections, then the multi-layer capacitor can be formed with parallel electrode connections, but the efficiency of the multi-layer capacitor is lowered
Solution Approach 1:
The patent transitions from a conventional planar electrode arrangement to a three-dimensional stacked configuration where connection electrodes are arranged in multiple vertical layers. This dimensional change allows parallel connections to be achieved through vertical stacking rather than horizontal spreading, preserving maximum electrode area while enabling parallel connections. The connection electrodes extend vertically through the capacitor structure, creating multiple connection paths without reducing the active electrode surface area.
Solution Approach 2:
The patent implements a nested structure where connection electrodes are embedded within the multi-layer capacitor assembly. The connection electrodes are positioned to extend through multiple dielectric layers and capacitor electrodes, creating a nested arrangement where connection elements are integrated within the capacitor structure rather than being external. This nesting allows parallel connections while maintaining compact geometry and maximum electrode area utilization.
2Adaptability or versatility
If external terminals are formed to allow parallel connections of electrodes, then parallel connections can be established, but the bottom electrode may be damaged due to external force
Solution Approach 1:
The patent provides mechanical protection to the bottom electrode by introducing a protective structure that absorbs or distributes external forces before they reach the fragile electrode. The package housing or protective layering is designed to cushion impacts and prevent direct transmission of external forces to the electrode, thereby maintaining electrode integrity while still allowing electrical connections to be made.
Solution Approach 2:
The patent introduces intermediate protective structures between the external environment and the bottom electrode. These intermediary elements (such as protective coatings, cushioning layers, or structural housings) act as mediators that transmit mechanical loads away from the electrode while maintaining electrical connection pathways. The intermediary structures decouple the external force application points from the sensitive electrode regions.
3Reliability
If the capacitor is packaged in a housing, then the capacitor is protected and securely mounted, but the complexity of the packaging structure increases
Solution Approach 1:
The patent designs the package housing to perform multiple functions simultaneously: it provides mechanical protection, establishes electrical connections, provides structural support, and enables thermal management. The housing is not merely a protective enclosure but an integrated component that combines protection, connection, and mounting functions into a single structure, thereby reducing overall system complexity despite the added protection.
Solution Approach 2:
The patent merges the protective housing with the connection structure and mounting features into an integrated assembly. Rather than having separate protective housing, connection terminals, and mounting brackets, these elements are combined into a unified package structure. The housing itself incorporates connection points and mounting features, eliminating the need for additional separate components and reducing assembly complexity.
Data Source
AI summary
Disclosed is a multi-layer capacitor package comprising: a multi-layer capacitor; connection electrodes coupled to capacitor electrodes respectively, wherein the connection electrodes in each group of the connection electrodes vertically overlap with each other, and first and second groups of the connection electrodes are horizontally spaced from each other; a package housing configured to receive therein the multi-layer capacitor; and first and second internal electrodes received in the housing to be coupled to the first and second groups of the connection electrodes respectively, wherein the first and second internal electrodes are horizontally spaced from each other.