Multi-Layer Coated Terminal for Solder-Free Semiconductor Connection
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Solution Overview
Problem
The existing terminal connection structures for coupling semiconductor modules to external devices require complex soldering processes, which increase manufacturing complexity and reduce durability, necessitating a solder-free connection method that enhances terminal durability.
Innovation Solution
A terminal connection structure featuring a male terminal with a first primary coat of Ni electroplating and a second primary coat of electroless NiP plating, providing different hardness levels to increase durability and reduce wear and warping, while allowing for secure coupling without solder.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a terminal connection structure uses solder to couple the terminal to the wiring, then the connection strength is improved, but the manufacturing process complexity increases
Solution Approach 1:
The patent removes the soldering process from the manufacturing sequence by designing a terminal structure that achieves direct mechanical and electrical connection between the male terminal inserted into the penetrating hole and the wiring, eliminating the need for solder while maintaining connection strength
Solution Approach 2:
The patent replaces the chemical bonding mechanism of soldering with a mechanical insertion system where the male terminal is directly inserted into the penetrating hole to establish both mechanical support and electrical connection, substituting a complex chemical process with a simpler mechanical operation
2Device complexity
If the terminal is designed for solder-free coupling, then the manufacturing process is simplified, but the terminal durability decreases
Solution Approach 1:
The patent applies composite material structure to the terminal by forming a multi-layer coating system on the male terminal, including a base material layer, an intermediate layer, and a surface layer with different material properties, where each layer contributes specific functions to enhance overall durability while maintaining solder-free connection capability
Solution Approach 2:
The patent modifies the physical and chemical parameters of the terminal surface through controlled coating processes, adjusting hardness, roughness, and compositional parameters of different layers to optimize both the mechanical strength for solder-free connection and the durability under operating conditions
3Reliability
If the terminal undergoes wear during operation, then the contact pressure decreases, but the connection reliability is maintained, which requires increasing the terminal hardness to reduce wear
Solution Approach 1:
The patent applies local quality enhancement by creating a multi-layer coating structure where the surface layer has significantly higher hardness than the base material, concentrating the wear resistance property at the contact surface while maintaining the ductility and toughness of the underlying layers to prevent crack propagation
Solution Approach 2:
The patent implements beforehand cushioning by designing the intermediate layer as a transition zone between the soft base material and the hard surface layer, which absorbs and distributes stress concentrations before they can propagate into the base material, preventing premature failure under cyclic loading and vibration conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure enhances durability by reducing wear and warping, maintaining contact pressure, and simplifying the manufacturing process, making it suitable for applications prone to vibration.
Implementation Method 1
a first primary coat 1621 of Ni electroplating and a second primary coat 1622 of electroless NiP plating
Implementation Method 2
a first primary coat 1621 of Ni electroplating and a second primary coat 1622 of electroless NiP plating
Data Source
Figure 1(a)~1(b)
Figure 2~3
Figure 4
AI summary
A terminal connection structure includes a male terminal; and a female terminal having an elasticity and configured to have the male terminal fitted therein such that the female terminal sandwiches the male terminal from opposite sides; wherein the male includes a base material, a first primary coat coated on the base material, a second primary coat coated on the first primary coat, and a surface layer coated on the second primary coat, and the first primary coat and the second primary coat have different hardnesses.