Multi-Layer Coil Component with Insulating Core for Rigidity
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Solution Overview
Problem
The miniaturization and thinning of coil components in electronic devices pose a challenge in maintaining rigidity while ensuring a sufficient thickness of magnetic material coverage, as traditional support members limit the permeability and efficiency of the coil.
Innovation Solution
A coil component design featuring a body with a magnetic material and a coil portion comprising multiple planar spiral pattern layers, where an insulating layer with varying thicknesses is used, embedding at least one coil pattern layer and including a core material to enhance rigidity and magnetic material volume without the need for a support member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a support member is used to maintain rigidity, then structural stability is improved, but the thickness of magnetic material covering the coil is reduced
Solution Approach 1:
The invention removes the support member from the coil structure, extracting the element that was causing the trade-off. By eliminating the support member entirely and relying on the self-supporting nature of the multi-layer coil pattern structure, the magnetic material can cover the full thickness without being displaced by a support component.
Solution Approach 2:
The invention transitions from a planar single-layer coil to a three-dimensional multi-layer stacked coil structure. By stacking multiple coil pattern layers vertically, the structure gains rigidity through increased dimensional complexity while maintaining or increasing the thickness of magnetic material coverage.
2Length of moving object
If the coil component is miniaturized and thinned, then device integration is improved, but rigidity is reduced
Solution Approach 1:
The invention resolves the rigidity-thickness contradiction by moving from a two-dimensional planar coil to a three-dimensional stacked structure. Multiple coil pattern layers are arranged vertically with insulating layers between them, creating a compact thick structure that maintains rigidity through vertical stacking rather than horizontal expansion.
Solution Approach 2:
The invention uses a composite structure combining multiple materials: conductive coil pattern layers, insulating resin layers, and magnetic material. This composite approach allows each layer to contribute its specific properties, with the stacked configuration providing rigidity while the overall structure remains thin enough for device integration.
3Reliability
If the thickness of magnetic material is increased to provide high permeability, then coil efficiency is improved, but the overall package size increases
Solution Approach 1:
The invention maximizes magnetic material utilization by stacking coil patterns vertically in multiple layers. This three-dimensional arrangement increases the effective volume of magnetic material within the coil structure without increasing the horizontal footprint, thereby improving permeability while maintaining a compact package size.
Solution Approach 2:
The invention implements a nested structure where multiple coil pattern layers are embedded within insulating resin layers, which are in turn surrounded by magnetic material. This nested arrangement allows efficient use of space, maximizing the magnetic material volume within the available package dimensions.
Data Source
AI summary
A coil component includes a body portion including a magnetic material, and a coil portion disposed in the body part. The coil portion includes a first coil pattern layer having a planar spiral pattern, an insulating layer formed of an insulating resin embedding at least a portion of the first coil pattern layer, and a second coil pattern layer disposed on the insulating layer and having a planar spiral pattern. The insulating layer includes a core material disposed between the first and second coil pattern layers, and a thickness of a lower region of the insulating layer disposed below the core material is greater than a thickness of an upper region of the insulating layer disposed above the core material.