Multi-Layer Compliant Probes for Semiconductor Testing
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Solution Overview
Problem
Current electrical contact probe technologies face challenges in achieving improved electrical and mechanical properties, reduced fabrication times and costs, increased versatility in design, and better material selection for electronic device testing, particularly at the wafer level and in packaged integrated circuits.
Innovation Solution
The development of compliant probes with multiple layers of structural materials, where each layer includes a core and shell structural material configuration, allowing for elastic electrical connections between electronic components. These probes are formed using electrochemical fabrication techniques, enabling precise control over material deposition and layer stacking to enhance conductivity and mechanical flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional single-material probe structures are used, then fabrication is simpler, but electrical conductivity and mechanical flexibility cannot be simultaneously optimized
Solution Approach 1:
The probe structure employs multiple layers of different materials (e.g., copper for high conductivity, beryllium copper for flexibility, nickel for oxidation resistance) to simultaneously achieve optimized electrical conductivity, mechanical flexibility, and chemical stability that cannot be obtained with a single material
2Reliability
If multi-layer multi-material probes are fabricated using conventional methods, then material properties can be optimized, but fabrication time and cost increase significantly
Solution Approach 1:
The invention replaces conventional mechanical fabrication methods (such as mechanical stacking and bonding of separate components) with electrochemical fabrication processes (electrodeposition and electroless deposition) that can build multi-layer structures in-situ, significantly reducing fabrication time and complexity
3Adaptability or versatility
If conventional fabrication methods are used, then manufacturing processes are established, but design versatility and independence between geometry and fabrication are limited
Solution Approach 1:
The electrochemical fabrication process allows independent control of deposition parameters (current density, deposition time, solution composition) to create varied geometries and material properties without changing the fundamental fabrication approach, enabling design versatility while maintaining manufacturing simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The probes provide improved electrical conductivity and mechanical flexibility, reducing fabrication complexity and costs while offering greater design versatility and independence between geometric configuration and the fabrication process, thus enhancing the testing of electronic devices.
Implementation Method 1
electrochemical, multi-layer, multi-material fabricating methods
Implementation Method 2
the core structural material extends at least a portion of the axial length of the probe and provides a conductive path along a length of the probe
Data Source
AI summary
Embodiments are directed to microscale and millimeter scale multi-layer structures (e.g., probe structures for making contact between two electronic components for example in semiconductor wafer, chip, and electronic component test applications). One or more layers of the structures include shell and core regions formed of different materials wherein the core regions are offset from a symmetric, longitudinally extending position.