Multi-layer Ceramic Cooler Metallization for EMC Shielding
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Solution Overview
Problem
As power components miniaturize and switching frequencies increase, additional circuit elements like shields and coils are needed near the components to manage high-frequency interference radiation, requiring more space and effective shielding to avoid EMC issues in existing ceramic carrier bodies.
Innovation Solution
A ceramic carrier body with multiple sintered metallization levels, including an additional level between the circuit and cooling elements, allows for increased space by accommodating further circuit elements and shielding components, using tungsten for inner metallization and copper for the top level, with vias or edge connections for electrical contact, and structured to form resistors, coils, and capacitors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional circuit elements and shielding components are added to manage high-frequency interference, then EMC performance improves, but the available space for circuit elements decreases
Solution Approach 1:
The patent transitions from a single-plane circuit layout to a multi-layer three-dimensional structure. Circuit elements are distributed across multiple metallization levels separated by ceramic plates, allowing shielding components and additional circuits to coexist without competing for the same two-dimensional space. This vertical stacking enables simultaneous accommodation of power components, shielding elements, and signal circuits.
Solution Approach 2:
The patent implements a nested structure where inner metallization layers are surrounded by outer layers, with ceramic plates nested between metallization levels. The shielding components are integrated within the multi-layer structure, with inner shielding layers positioned between outer circuit layers. This nesting allows multiple functional elements to occupy overlapping spatial volumes at different depths.
2Productivity
If miniaturization of power components is pursued, then productivity increases, but the space for additional circuit elements decreases
Solution Approach 1:
By moving from two-dimensional planar layouts to three-dimensional multi-layer configurations, the patent decouples the relationship between component size and total circuit capacity. Miniaturized power components occupy reduced footprint area, while the vertical stacking of multiple metallization levels provides additional volume for accommodating shielding elements and auxiliary circuits that would otherwise compete for the same planar space.
3Reliability
If extensive shielding is implemented to prevent EMC problems, then reliability improves, but device complexity increases
Solution Approach 1:
The patent combines multiple functions into integrated structures. The ceramic plates serve dual purposes as both mechanical substrates for metallization layers and as dielectric insulators providing electrical isolation between layers. The metallization layers simultaneously function as circuit conductors, shielding elements, and structural support. This merging reduces the number of separate components needed compared to conventional layered designs.
Solution Approach 2:
Each component in the multi-layer structure performs multiple functions. The inner metallization layers provide both circuit functionality and electromagnetic shielding. The ceramic plates provide mechanical support, electrical insulation, and thermal management. This multi-functionality reduces overall device complexity by eliminating the need for separate dedicated shielding components and structural elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances space utilization, improves interference shielding, and effectively accommodates electronic components, enhancing thermal conductivity and EMC performance while maintaining structural integrity.
Implementation Method 1
The substrate preferably consists of the ceramic materials aluminum oxide Al2O3 or aluminum nitride AlN. Both materials have good thermal conductivity
Implementation Method 2
a ceramic support body with cooling elements and with sintered metallization areas
Data Source
Figure 1
AI summary
To provide more space for additional circuit elements (coils, capacitors) and/or to accommodate the additional circuit elements necessary for shielding the circuits, it is proposed to arrange the metallization areas in at least two metallization levels one above the other. The carrier body (1) has a surface on which sintered metallization areas are arranged in a first metallization level. These areas support electronic components and/or are structured to form resistors or coils. These metallization areas, together with the components and/or the formed resistors or coils, are covered by a ceramic plate (5). Optionally, further sintered metallization areas are arranged on the ceramic plate in additional metallization levels, each covered by a ceramic plate. On the uppermost,Sintered metallization areas are arranged in a metallization plane on the ceramic plate (5) facing away from the cooling elements for receiving circuit elements.