Multi-layer Eddy Current Probe via Common Inner Through-Connection
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Solution Overview
Problem
Existing multi-layer eddy current probes are costly to produce and lack sensitivity for detecting small defects in electrically conductive materials during non-destructive testing.
Innovation Solution
A multi-layer eddy current probe design featuring a coil group with three or more flat coils connected via a common inner through-connection, allowing for enhanced electromagnetic field concentration and increased spatial resolution, while reducing the number of vias and simplifying production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple flat coils are arranged in different layers and connected via individual vias, then electromagnetic field concentration is improved, but the number of vias increases and production complexity increases
Solution Approach 1:
Multiple individual vias for connecting flat coils in different layers are merged into a single common inner through-connection that passes through all coil groups. This reduces the total number of vias while maintaining the multi-layer coil structure necessary for electromagnetic field concentration and spatial resolution.
Solution Approach 2:
The common inner through-connection serves multiple functions simultaneously: it connects inner connection ends across multiple coil groups in different layers, provides a reference potential, and reduces production complexity. This single structure replaces what would otherwise require multiple separate vias.
2Measurement precision
If multiple flat coils are arranged in different layers, then electromagnetic field concentration is improved, but production cost increases
Solution Approach 1:
The patent merges multiple via connections into a single common inner through-connection, simplifying the manufacturing process. This reduction in the number of vias directly lowers production cost while preserving the multi-layer coil arrangement that provides high spatial resolution.
3Reliability
If flat coils are connected via multiple vias, then electrical connection reliability is improved, but production time increases
Solution Approach 1:
Multiple separate via connections are merged into a single common inner through-connection that passes through all coil groups. This reduces the number of connection steps required during production, thereby reducing production time while maintaining reliable electrical connections across all layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables high-sensitivity eddy current testing for small defects with reduced production costs and increased efficiency, allowing for stronger electromagnetic fields and improved spatial resolution.
Implementation Method 1
An eddy current probe constructed with coils comprises one or more field coils (or excitation coils), which are connected to an AC voltage source to carry out the test and can then generate a high-frequency electromagnetic alternating field, which penetrates into the test material during the test and essentially in a layer near the surface of the test material generates eddy currents
Implementation Method 2
eddy currents, which react through mutual induction on one or more measuring coils (or receiver coils) of the eddy current probe
Data Source
Figure 1~2
Figure 3A~3B
Figure 4A~5B
AI summary
The invention relates to a multi-layer eddy current probe (110) having a plurality of spiral-shaped flat coils (S1-S4), which are arranged in different coil layers (114) of a multi-layer array (112), wherein between adjacent coil layers of the multi-layer array, an insulating layer (116) each of electrically insulating material is arranged. Each of the flat coils has an inner connection end (I1-I4) and an outer connection end (A1-A4). Selected connection ends of selected flat coils of different coil layers are electrically connected to one another by means of through-platings. The flat coils form at least one coil group (200) having at least three flat coils (S1-S4), which are arranged on top of one another in different layers, wherein the inner connection ends (I1-I4) of the at least three flat coils of the coil group are connected in an electrically conductive manner by way of a common inner through-plating (VI).