Multi-Layer Element Substrate for Printheads
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional printheads with electrothermal transducing elements face issues with power consumption and reliability due to increased discharge ports and faster printing speeds, leading to potential disconnection and corrosion from ink intrusion, especially when abnormal driving pulses or contaminants cause disconnection.
Innovation Solution
A multi-layer element substrate design with an electrothermal transducing element, a protective film, an anti-cavitation film, and separated electrical wires, where connection members electrically connect the wires without direct contact to the transducing element, reducing the thickness of the protective film and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If the thickness of the protective film is reduced to improve heat transfer efficiency, then power consumption decreases, but the reliability of protecting electrical wires from ink intrusion deteriorates
Solution Approach 1:
The protective structure is divided into two segments: a first protective film covering the electrothermal transducing element and a second protective film covering the electrical wires. This segmentation allows each film to be optimized independently - the first film can be thin for heat transfer efficiency while the second film provides sufficient thickness for wire protection.
Solution Approach 2:
Different regions of the protective film structure have different thicknesses and material properties tailored to their specific functions. The region covering the transducing element has different characteristics than the region covering the electrical wires, allowing optimal heat transfer where needed while providing adequate protection where required.
2Manufacturing precision
If a plug-type connection layer is used to planarize the surface, then the protective film thickness can be reduced, but the risk of connection layer melting or shock damage increases when disconnection occurs
Solution Approach 1:
A buffer layer is introduced as an intermediary between the electrical wires and the connection layer. This buffer layer absorbs mechanical stress and protects the connection layer from shock damage, while still allowing for effective heat transfer and maintaining surface planarity.
Solution Approach 2:
The buffer layer is positioned in advance to cushion and absorb potential shock or stress that might occur during operation. This preventive measure protects the connection layer from damage before actual disconnection events occur.
3Device complexity
If electrical wires are arranged directly on the electrothermal transducing element, then device complexity is reduced, but heat transfer efficiency deteriorates due to increased protective film thickness
Solution Approach 1:
The wiring arrangement is moved from a two-dimensional surface arrangement to a three-dimensional layered structure. Electrical wires are positioned in different layers and connected through vertical connection members, allowing heat transfer optimization in the horizontal plane while maintaining electrical connectivity in the vertical dimension.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces power consumption, improves image quality, and prevents corrosion by localizing disconnections and ensuring efficient heat transfer, while maintaining high reliability and precision in ink discharge.
Implementation Method 1
a current is supplied by applying voltage from the electrical wire to the electrothermal transducing element, and film boiling is caused to occur in a liquid such as ink by causing the electrothermal transducing element to generate heat
Implementation Method 2
To protect the electrical wire and the electrothermal transducing element from liquid (ink), the electrical wire and the electrothermal transducing element are covered with a protective film
Implementation Method 3
an anti-cavitation film which is formed on the protective film and protects the electrothermal transducing element from a shock
Data Source
AI summary
An element substrate of multi-layer structure, comprising an electrothermal transducing element formed in a first layer, a protective film covering the electrothermal transducing element, an anti-cavitation film formed on the protective film, a first electrical wire formed in the same layer as the anti-cavitation film, arranged to be separated from the electrothermal transducing element, and electrically connected to at least one end of the electrothermal transducing element, a second electrical wire on an opposite side, in relation to the electrothermal transducing element, to the protective film, and formed in a second layer, and a first connection member that extends between the first and second layers, and that electrically connects the first and second electrical wires.