Multi-Layer Fan Base with Embedded Conductors for Low-Noise Cooling
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Solution Overview
Problem
Existing fan assemblies in electronic devices are heavy and prone to deflection, leading to impeller contact with the cover and unwanted noise, while requiring multiple flexible circuits for electrical connections, which increases complexity and weight.
Innovation Solution
A fan base with multiple layers, including metal layers for stiffness and a core layer such as a PCB for reduced weight and integrated electrical connections, eliminating the need for flexible circuits and minimizing deflection, and incorporating embedded electrically conductive assemblies for power and signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If multiple flexible circuits are used for electrical connections, then electrical connectivity is achieved, but device complexity and weight increase
Solution Approach 1:
The patent merges the structural support function and electrical connection function into a single integrated component - the multi-layer fan base. The metal layers provide structural support while the PCB layers provide electrical connections, eliminating the need for separate flexible circuits and reducing overall complexity
Solution Approach 2:
The fan base is designed to perform multiple functions simultaneously: it serves as a structural support element, an electrical distribution hub, and a mounting platform for components. This multi-functionality reduces the total number of components needed in the assembly
2Strength
If metal layers are used for fan base, then stiffness and structural integrity are improved, but weight increases
Solution Approach 1:
The fan base uses a composite structure combining metal layers (for stiffness) with a PCB core layer (for weight reduction and electrical functionality). This composite approach allows the structure to achieve the required mechanical strength while minimizing weight compared to solid metal construction
Solution Approach 2:
The fan base is divided into multiple thin layers (metal layers and PCB core layer) rather than using a single thick metal piece. This segmentation reduces weight while maintaining structural integrity through the distributed layer structure
3Object-affected harmful factors
If fan base deflection is reduced, then impeller contact and noise are minimized, but manufacturing complexity increases
Solution Approach 1:
The combination of metal layers and PCB core layer creates a composite structure that provides high stiffness-to-weight ratio, effectively reducing deflection and preventing impeller contact while managing manufacturing complexity through standardized layer fabrication processes
Data Source
AI summary
A fan assembly includes one or more electrically conductive assemblies designed to provide electrical signals and/or power to electrical components external to the fan assembly. The one or more electrically conductive assemblies are embedded in the base of the fan assembly. A fan assembly with embedded electrically conductive assemblies can electrically couple with a main logic board carrying circuits (e.g., logic circuitry or control circuitry), as well as an input-output board. As a result, the circuitry on the main logic board may provide instructions or commands to one or more electrical components carried by the input-output board. Using the one or more electrically conductive assemblies, electronic device may require fewer flexible circuits.