Multi-Layer Heat Pipe Heat Sink for Thermal Diffusion
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Solution Overview
Problem
Conventional heat sinks with heat pipes arranged in a single layer on a heat receiving plate suffer from insufficient thermal diffusion and heat dissipation efficiency due to constraints on pipe bending and arrangement, leading to inadequate cooling performance, especially in mobile and electronic devices.
Innovation Solution
A heat sink design featuring heat pipes arranged in multiple layers with non-identical positions on the heat receiving plate, combined with a flat, U-shaped, or channel-shaped configuration and the use of heat conductors around the pipes to enhance thermal diffusion and reduce thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If heat pipes are arranged in a single layer on the heat receiving plate, then the structure is simple and easy to manufacture, but thermal diffusion on the surface of the heat receiving plate is insufficient
Solution Approach 1:
The patent transitions from a single-layer heat pipe arrangement to a multi-layer configuration, adding the vertical dimension to the heat pipe layout. This allows heat pipes to be arranged at different heights above the heat receiving plate, enabling both simple manufacturing (by maintaining regular patterns within each layer) and improved thermal diffusion (by distributing heat pipes across multiple vertical levels and offsetting positions between layers).
2Temperature
If heat pipes are arranged in multiple layers with non-identical positions, then thermal diffusion and heat dissipation efficiency are improved, but device complexity increases
Solution Approach 1:
The patent divides the heat pipe system into multiple discrete layers, with each layer containing heat pipes at specific positions. This segmentation allows for systematic arrangement where the first layer has heat pipes at certain positions and the second layer has heat pipes at different positions, creating a structured complexity that improves thermal performance while remaining manageable in design and manufacturing.
3Ease of manufacture
If continuous flow path heat pipes are used, then manufacturing is simplified, but heat pipes operate only in the vicinity just above the heating element reducing thermal diffusion
Solution Approach 1:
The patent extends the operational range of continuous flow path heat pipes by arranging them in multiple vertical layers with offset positions. This vertical dimensionality allows the heat pipes to operate effectively across a broader spatial region, not just immediately above the heating element, thereby improving thermal diffusion while maintaining the manufacturing simplicity of continuous flow paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves thermal diffusion and heat dissipation efficiency across the heat receiving plate, leading to enhanced cooling performance by ensuring even heat distribution and reduced thermal resistance, thus effectively addressing the limitations of single-layer heat sinks.
Implementation Method 1
heat pipes formed of a tube body thermally connected to the heat receiving plate
Implementation Method 2
heat pipes, comprising non-meandering thin tunnel heat pipe in which heat transport by latent heat of working fluid (heat transport by evaporation and condensation during vapor movement of working fluid) is main principle of heat transport
Implementation Method 3
heat dissipation fins thermally connected to the heat receiving plate
Implementation Method 4
heat dissipation fins erected on the heat pipes
Implementation Method 5
a heat receiving plate thermally connected to a heating element
Data Source
AI summary
Provided is a heat sink having excellent heat dissipation efficiency by having excellent thermal diffusion characteristics in a planar direction of a heat receiving plate. The heat sink has the heat receiving plate that is thermally connected to a heating element, heat pipes that are thermally connected to the heat receiving plate and are formed from a tube body, and heat dissipation fins that are thermally connected to the heat receiving plate, wherein the heat pipes are provided in a plurality of layers in a vertical direction to a surface of the heat receiving plate, and in at least two layers of the plurality of layers, positions of the heat pipes on the surface of the heat receiving plate are not identical to each other.