Multi-Layer Heat Spreader with Phase Change Material for Surface Temperature Control
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Solution Overview
Problem
Conventional heat dissipating devices for electronic devices, such as mobile devices, often lead to uncomfortable surface temperatures due to inefficient heat dissipation, causing the backside to overheat and potentially burn users.
Innovation Solution
A multi-layer heat dissipating device incorporating a first and second heat spreader layer, spacers, and phase change materials (PCMs) with varying melting temperatures, where the PCMs store heat and delay its release to prevent peak surface temperatures, effectively dissipating heat away from heat-generating regions while maintaining user-friendly surface temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a single heat spreader is used to dissipate heat from the die, then heat dissipation is achieved, but the back side surface temperature becomes too high and uncomfortable for users
Solution Approach 1:
The heat dissipation system is divided into multiple layers: a first heat spreader layer coupled to the die, a second heat spreader layer, and phase change material layers positioned between them. This segmentation allows different components to perform specialized functions - the first heat spreader layer captures heat at the source, the phase change material absorbs and stores thermal energy, and the second heat spreader layer distributes heat to the back side surface, thereby reducing peak temperatures while maintaining effective heat dissipation.
Solution Approach 2:
Phase change material is introduced between the first and second heat spreader layers to exploit the phase transition phenomenon. The PCM absorbs excess heat when it melts (phase change from solid to liquid), storing thermal energy without significant temperature increase. This phase transition mechanism effectively buffers temperature peaks at the back side surface while continuing to dissipate heat through the system.
2Loss of energy
If heat is efficiently dissipated through the back side surface, then heat removal from the die is improved, but the back side surface becomes hot enough to burn users
Solution Approach 1:
The phase change material is positioned in advance between the heat spreader layers to intercept and absorb heat before it reaches the back side surface. By performing this heat absorption action preliminarily within the device structure, the system prevents the harmful effect of high surface temperatures from occurring in the first place, while maintaining efficient heat removal through the organized multi-layer architecture.
Solution Approach 2:
The phase change material acts as an intermediary layer between the heat-generating die and the user-contacting back side surface. It mediates the heat transfer process by absorbing thermal energy through phase change, thereby decoupling the efficient heat removal function from the harmful high-temperature effect that would otherwise be transmitted to the user's hand.
3Temperature
If a multi-layer structure with phase change material is implemented, then peak surface temperatures are reduced, but device complexity increases
Solution Approach 1:
The patent combines multiple functions into an integrated multi-layer heat dissipating device structure. The first heat spreader layer, phase change material, second heat spreader layer, and spacer are merged into a single cohesive assembly that performs heat capture, thermal energy storage, and heat distribution simultaneously. This merging approach reduces the need for separate components and simplifies integration into the electronic device while achieving superior temperature control.
Solution Approach 2:
The heat dissipating device employs a nested structure where the phase change material is positioned within the space between the two heat spreader layers, and the spacer is coupled to both layers to maintain the nested arrangement. This nesting approach maximizes the use of available space within the device thickness constraint, allowing the complex multi-functional structure to be compactly integrated without significantly increasing the overall device footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multi-layer heat dissipating device efficiently manages heat dissipation, reducing peak surface temperatures and ensuring the device operates within safe temperature limits for users, thereby enhancing user comfort and device performance.
Implementation Method 1
phase change materials (PCMs) with varying melting temperatures, where the PCMs store heat and delay its release
Implementation Method 2
a first phase change material (PCM) and a second PCM... the first PCM has a higher melting temperature than the second PCM
Implementation Method 3
a first heat spreader layer configured to be coupled to a region configured to generate heat... efficiently dissipating heat away from heat-generating regions
Data Source
Figure 1~3
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Figure 6
AI summary
A heat dissipating device that includes a first heat spreader layer, a second heat spreader layer, a first spacer, a second spacer, a first phase change material (PCM), and a second phase change material (PCM). The first heat spreader layer includes a first spreader surface and a second spreader surface. The second heat spreader layer includes a third spreader surface and a fourth spreader surface. The first spacer is coupled to the first heat spreader layer and the second heat spreader layer. The second spacer is coupled to the first heat spreader layer and the second heat spreader layer. The first PCM is located between the first heat spreader layer and the second heat spreader layer. The first PCM is surrounded by the first spacer. The second PCM is between the first heat spreader layer, the second heat spreader layer, the first spacer and the second spacer.