Multi-Layer Inductor Short Circuit Detection via Segmented Wiring
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Solution Overview
Problem
Conventional semiconductor devices with inductors face challenges in detecting short circuits between wires, which reduce sensor sensitivity and make it difficult to sort out faulty devices, due to the difficulty in measuring resistance variations and distinguishing short circuits from normal variations in the wiring layer.
Innovation Solution
The semiconductor device incorporates a configuration with multiple inductors formed in wiring layers, where the metal layers of adjacent inductors extend around the periphery in the same direction and are coupled through slit or columnar vias, allowing for increased sensitivity and reliable detection of short circuits by maintaining a potential difference, enabling effective sorting and reducing characteristic deterioration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the number of turns of the inductor is increased to improve sensor sensitivity, then the sensor sensitivity is improved, but the probability of particle adhesion and short circuit between wires increases
Solution Approach 1:
The inductor is divided into multiple separate wiring layers instead of using a single continuous wire. Each wiring layer contains a portion of the inductor turns, and the layers are stacked vertically with insulation between them. This segmentation prevents particle adhesion from causing complete short circuits while maintaining the required number of turns for sensitivity.
Solution Approach 2:
The inductor structure transitions from a two-dimensional planar winding to a three-dimensional multi-layer stacked configuration. By distributing turns across multiple vertical layers separated by insulating films, the design achieves high turn counts without increasing the planar footprint or wire density, thereby reducing short circuit risk while maintaining sensitivity.
2Measurement precision
If the wiring interval between inductors is made narrow to increase the number of turns, then the sensor sensitivity is improved, but the difficulty of detecting short circuits increases due to resistance variation
Solution Approach 1:
A test terminal is introduced as an intermediary access point to the internal inductor structure. This external terminal allows semiconductor testers to measure resistance values of the inductor wiring without requiring direct internal access, enabling detection of short circuits despite the narrow wiring intervals and high resistance variations in the multi-layer configuration.
Solution Approach 2:
The detection method transitions from direct physical inspection or complex multi-point measurement to a simplified electrical resistance measurement through the test terminal. This substitution enables automated semiconductor testing equipment to detect short circuits efficiently without requiring manual intervention or complex measurement setups.
3Measurement precision
If multiple inductors are formed in multiple wiring layers to improve sensitivity, then the sensor sensitivity is improved, but the complexity of the device structure increases
Solution Approach 1:
The multi-layer wiring structure serves dual functions: it provides the necessary number of inductor turns for high sensitivity while simultaneously acting as the structural framework for the entire semiconductor device. The same wiring layers that form the inductors also provide interconnects and are integrated with other device components, reducing the need for separate structural elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances sensor sensitivity and allows for reliable detection and removal of short circuits, minimizing sensor characteristic variations and improving the accuracy of magnetic field detection in power meters.
Implementation Method 1
electric power is generated in the inductor according to the change of the magnetic field
Data Source
AI summary
In order to easily sort failures due to short circuit between wires in an inductor, a semiconductor device includes a plurality of inductors (first inductor, second inductor) formed in a plurality of wiring layers. In each of the wiring layers, the metal layer of the first inductor and the metal layer of the second inductor respectively extend around the peripheral region from the inner periphery to the outer periphery in the same direction. The metal layer of the first inductor and the metal layer of the second inductor are arranged so as to be adjacent to each other.