Multi-Layer Liner with Metallic Barrier for Curling Resistance
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Solution Overview
Problem
Conventional multi-layered liners used in container-and-closure assemblies are thick, require excessive materials and energy for sealing, and are prone to curling in humid conditions, necessitating a thinner chip board layer and improved sealing with reduced environmental impact.
Innovation Solution
A multi-layered liner comprising a first polymeric material, a metallic layer, a thin chip board layer, and a second polymeric layer, with optional adhesive layers, where each layer's thickness is optimized to minimize material usage and prevent curling, particularly in humid environments, while providing a superior seal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If the chip board layer thickness is reduced to use less material and decrease environmental footprint, then material usage and environmental impact are improved, but the liner becomes more prone to curling in humid conditions
Solution Approach 1:
The patent applies composite materials by combining multiple layers with different properties: a thin chip board layer (providing compressibility), a metallic layer (providing moisture barrier and dimensional stability), and polymeric layers (providing sealability and flexibility). This composite structure allows the chip board layer to be thinner than conventional liners while the metallic layer compensates for potential curling through its dimensional stability in humid conditions.
Solution Approach 2:
The patent changes the thickness parameter of the chip board layer from conventional thickness (>0.0070 inches) to a reduced thickness (≤0.0055 inches). This parameter change reduces material usage and environmental footprint while the overall multi-layer construction maintains sufficient structural integrity and curling resistance through the combined properties of all layers.
2Loss of substance
If the chip board layer thickness is reduced, then environmental footprint is decreased, but the liner requires more adhesive or heat to engage to the container
Solution Approach 1:
The composite multi-layer structure provides a balanced solution where the thin chip board layer reduces environmental footprint while the metallic and polymeric layers contribute to overall sealability and structural support. This distribution of functions across layers reduces the demand on adhesive and heat energy during engagement, as each layer contributes its specific properties to the overall sealing performance.
3Stability of the object's composition
If conventional multi-layered liners are used with thicker chip board layer, then curling resistance is maintained, but material usage and environmental impact increase
Solution Approach 1:
The patent replaces the reliance on a single thick chip board layer for curling resistance with a composite structure where multiple thinner layers collectively provide dimensional stability. The metallic layer specifically contributes to moisture barrier and dimensional stability, allowing the chip board layer to be thinner while maintaining overall curling resistance.
4Loss of substance
If the liner is made thinner overall, then material usage is reduced, but the seal quality to the container may be compromised
Solution Approach 1:
The patent applies local quality by optimizing the thickness and material properties of each individual layer for its specific function. The polymeric layers are designed with appropriate thickness and composition to provide effective sealing contact with the container, while the chip board and metallic layers provide structural support and dimensional stability. This localized optimization ensures seal quality is maintained despite reduced overall thickness.
Solution Approach 2:
The composite multi-layer construction provides a balanced solution where each layer contributes specific properties: polymeric layers for sealability, metallic layer for moisture barrier and dimensional stability, and chip board for compressibility. This functional distribution across layers maintains seal quality while reducing overall material usage compared to conventional single-material liners.
Data Source
AI summary
The invention relates to a laminate liner for sealingly engaging a container in an associated container and closure assembly. The liner can include at least first, second, third, and fourth layers, respectively, and have a thickness between 0.0060-0.0120 inches. The first and bottom layer, can comprise a plastic polymeric material, and have a thickness between 0.0005-0.0015 inches. The second layer can comprise a metallic material and have a thickness between 0.0005-0.0010 inches. The third layer can comprise a chip board material, and have a thickness between 0.0045-0.0055 inches. The third layer can prevent the liner from curling or deforming from its preferably flat shape. The fourth and top layer can comprise a plastic polymeric material and have a thickness between 0.0005-0.0015 inches. An adhesive bonding layer, having a thickness between 0.0003-0.0005 inches, can be located between first, second, third, and fourth layers, to bond adjacent layers together.