Multi-Layer Power Supply Lines for Display Peripheral Area
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Solution Overview
Problem
Display apparatuses face challenges in reducing the size of the peripheral area while improving brightness and display quality, particularly due to high wiring resistance in power supply lines which increases power consumption and degrades display quality.
Innovation Solution
The display apparatus incorporates a substrate with a first-layer and second-layer power supply line in the peripheral area, where the second-layer power supply line extends to a driver area with unevenness on its surface, and is electrically connected to a light emitting structure, reducing wiring resistance by forming a double wiring configuration and using organic insulation materials, and applying a voltage level of −3 volts or less to the second electrode.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single-layer power supply line is used in the peripheral area, then the device complexity is reduced, but the wiring resistance increases leading to higher power consumption and degraded display quality
Solution Approach 1:
The patent transitions from a single-layer power supply line to a multi-layer configuration with first-layer and second-layer power supply lines disposed at different heights. The second-layer power supply line is positioned above the first insulation layer, creating a three-dimensional wiring structure that reduces wiring resistance and power consumption while managing the increased device complexity through systematic layering.
Solution Approach 2:
The patent employs composite insulation structures combining organic insulation materials (first insulation layer, second insulation layer) with inorganic encapsulation layers. This composite approach provides both electrical insulation and protective encapsulation, managing the complexity by integrating multiple functions into a unified multi-layer power supply system.
2Area of stationary object
If the peripheral area size is reduced to improve display area ratio, then the display quality is improved, but the wiring resistance of power supply lines increases leading to higher power consumption
Solution Approach 1:
By extending the power supply lines into the third dimension with multiple layers, the patent reduces the wiring resistance despite the reduced peripheral area. The vertical stacking of power supply lines allows for optimized current paths that compensate for the shorter horizontal distances available in a compact peripheral region.
Solution Approach 2:
The patent segments the power supply function across multiple layers, with the first-layer power supply line handling certain routing functions and the second-layer power supply line providing additional parallel paths. This segmentation reduces the overall resistance by distributing the current flow across multiple conductive paths within the constrained peripheral area.
3Loss of energy
If a multi-layer power supply line configuration is implemented, then the wiring resistance is reduced and power consumption is lowered, but the device complexity increases
Solution Approach 1:
The multi-layer power supply structure serves multiple functions: the first insulation layer provides electrical isolation between layers, the second insulation layer provides additional isolation and structural support, and the unevenness features serve both as mechanical interlocking elements and as pathways for via connections. This multi-functionality justifies the increased device complexity by integrating several purposes into a unified structure.
Solution Approach 2:
The patent implements a nested structure where the first-layer power supply line is embedded within the substrate plane, the first insulation layer is disposed over it, and the second-layer power supply line is positioned above the first insulation layer. This nested arrangement organizes the complexity hierarchically, with each layer serving its specific function while contributing to the overall low-resistance power distribution network.
4Reliability
If unevenness is added to the power supply line surface to reduce resistance, then the electrical conductivity is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent modifies the geometric parameters of the power supply lines by introducing controlled unevenness features on the surface of the second-layer power supply line. These unevenness features increase the effective surface area and improve electrical contact, thereby enhancing conductivity. The parameter changes are implemented within manufacturable tolerances to balance improved reliability with acceptable manufacturing precision requirements.
Data Source
AI summary
A display apparatus includes a substrate, a first-layer power supply line disposed on a substrate in a peripheral area which surrounds a display area in which an image is displayed, a first insulation layer on the substrate on which the first-layer power supply line is disposed, a second-layer power supply line disposed on the first insulation layer and the first-layer power supply line, and contacting the first-layer power supply line, a second insulation layer on the first insulation layer on which the second-layer power supply line is disposed, and a light emitting structure disposed on the second insulation layer and including a first electrode, a light emitting layer and a second electrode which is electrically connected to the second-layer power supply line.