Multi-layer Routing Paths in Fractured Space
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Solution Overview
Problem
In integrated circuit design, complex routing rules and the need to preserve the relative order of interconnect segments pose challenges, particularly when modifications require accommodating additional features without introducing bends or violating design constraints.
Innovation Solution
The implementation of multi-layer local maximal spanning routing paths using spacetiles, which allows for the identification and prioritization of local maximally spanning spacetiles to push or move victim circuit features while satisfying design constraints, including the preservation of relative order and prohibition of bends.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If routing rules are made restrictive to comply with design constraints, then design rule compliance is improved, but routing flexibility deteriorates
Solution Approach 1:
The patent transitions from two-dimensional planar routing to three-dimensional multi-layer routing by introducing vertical dimension through layers and vias. This allows interconnect segments to route through multiple layers, providing additional pathways that satisfy design rules while maintaining routing flexibility. The 3D routing space enables circumvention of blocking features by moving to different layers rather than being constrained to a single plane.
Solution Approach 2:
The routing path is divided into multiple segments across different layers. Instead of requiring a single continuous path in one layer, the interconnect is segmented into multiple linear segments connected by vias between layers. Each segment can be independently routed to avoid blocking features, and the segmentation allows the design to satisfy no-bend rules within each layer while achieving complex routing goals through layer transitions.
2Adaptability or versatility
If additional circuit features are added to the design, then functionality is improved, but space availability for existing interconnects deteriorates
Solution Approach 1:
When additional circuit features encroach upon space claimed by existing interconnect segments, the patent utilizes the vertical dimension by routing the affected interconnect through multiple layers. This allows the interconnect to bypass the encroaching feature by transitioning to adjacent layers, thereby accommodating both the new functionality and the existing routing requirements without compromising either.
Solution Approach 2:
The routing solution is made dynamic by enabling interconnect segments to adapt their path through multi-layer transitions. When a new feature is added and blocks the original routing path, the system dynamically reroutes the interconnect through available layers, adjusting the routing configuration to accommodate the design change while maintaining connectivity and satisfying design rules.
3Adaptability or versatility
If routing paths are modified to accommodate new features, then design adaptability is improved, but the number of bends in interconnects increases
Solution Approach 1:
The patent resolves the bend issue by utilizing the vertical dimension through multi-layer routing. When an interconnect needs to change direction to accommodate new features, instead of introducing bends in the same layer, the design transitions to an adjacent layer where the routing direction can change more freely. This layer transition approach allows directional changes without violating no-bend rules within individual layers.
Solution Approach 2:
The interconnect path is segmented into multiple linear segments across different layers, connected by vias. Each segment maintains a straight or simple path within its layer, avoiding bends. The segmentation allows the overall routing to achieve complex functionality through multiple straight segments rather than requiring bends in single-layer paths, thereby maintaining design adaptability while minimizing bend count.
4Reliability
If multi-layer routing is implemented to maintain no-bend rules, then routing constraint compliance is improved, but routing path length increases
Solution Approach 1:
The patent applies partial multi-layer routing only where necessary to maintain no-bend rules, rather than routing all interconnects through multiple layers. For segments where direct routing in a single layer is possible without bends, the design remains in that layer to minimize length. Multi-layer transitions are used selectively only when required to avoid bends, thereby achieving constraint compliance while minimizing the excessive path length that would result from universal multi-layer routing.
Data Source
AI summary
Various embodiments identify a design including circuit features and identify an operation that produces an aggressor for victim(s). The operation on the aggressor and the set of victims are implemented using local maximally spanning spacetile(s) while satisfying some design requirements. Where the set of victims includes interconnects, the design may allow no bend in some interconnects. One or more spacetiles are used to perform the operation on the aggressor and implement the interconnects while introducing no bends in the interconnects by using local maximally spanning spacetile(s). Some implementation may perform block modeling for the aggressor to perform the operation on the aggressor and implement a set of victims while preserving the relative order of the interconnects by using the block modeling for the aggressor.