Multi-layer Vent with Angled Walls for Airflow and EMI Shielding

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Solution Overview

Problem

Information handling systems face challenges in balancing airflow impedance and electromagnetic interference (EMI) shielding as components generate more heat and electromagnetic energy, requiring increased airflow and EMI shielding capabilities.

Innovation Solution

A vent design featuring multiple plates with structures that include base openings, contact areas, and angled walls with holes to maximize open percentage for reduced airflow impedance and enhanced EMI shielding, where the shape, number, and size of holes and walls are optimized to deflect electromagnetic energy and facilitate airflow.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a vent with larger openings is used to increase airflow, then airflow impedance decreases, but EMI shielding capability deteriorates

Engineering Contradiction:
ImproveairflowVSAvoidEMI shielding
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The vent is segmented into multiple plates stacked together, each plate containing structures with openings. This segmentation allows the system to achieve both high airflow (through multiple stacked openings) and good EMI shielding (through the multi-layer configuration that blocks electromagnetic waves)

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The solution transitions from a single-plane vent to a three-dimensional multi-plate structure. By stacking plates in the vertical dimension, the design achieves increased open percentage for airflow while maintaining EMI shielding through the layered configuration that disrupts electromagnetic wave propagation

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Object-affected harmful factors

If a vent with more EMI shielding is used, then electromagnetic interference protection increases, but airflow impedance increases

Engineering Contradiction:
ImproveEMI shieldingVSAvoidairflow
Core Design Contradiction:
Object-affected harmful factorsVSProductivity

Solution Approach 1:

Different regions of the vent structure have different properties: the plates provide EMI shielding while the structures with openings provide airflow paths. The local quality of each structure (combining both shielding and airflow functions) resolves the contradiction between overall shielding and overall airflow

Inventive Principle:
Principle #3Local quality

3Power

If components increase in performance capabilities, then system performance improves, but heat generation and EMI increase requiring more airflow and shielding

Engineering Contradiction:
Improvecomponent performanceVSAvoidheat and EMI
Core Design Contradiction:
PowerVSObject-generated harmful factors

Solution Approach 1:

The vent structures serve multiple functions simultaneously: they provide airflow paths for cooling, EMI shielding for electromagnetic protection, and structural support. This multi-functionality allows the system to handle increased heat and EMI from high-performance components through a single integrated solution

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The vent design effectively decreases airflow impedance while increasing EMI shielding, allowing for improved cooling and reduced electromagnetic interference, even with increased performance capabilities of system components.

Implementation Method 1

The shape of each structure may be configured to maximize EMI shielding of the vent... each structure is formed with a single curved or arcuate wall, forming a conical, frustoconical shape or spherical shape... each structure is formed with three or four flat walls, forming a pyramidal shape

Methodology Applied
Scientific EffectElectromagnetic deflection: Reflection

Implementation Method 2

A common approach for cooling information handling systems is to generate an airflow in the chassis to facilitate convective heat transfer from the components. The airflow flows through the chassis and is heated by the components, and the heated airflow exits the chassis to the ambient environment through a vent

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS11432413B2Multi-layer vent for increased airflow and EMI shielding in an information handling system
Publication Date: 2022.08.30 DELL PROD LP
  • US11432413B2 patent drawing
  • US11432413B2 patent drawing
  • US11432413B2 patent drawing

AI summary

A vent for reduced airflow impedance and increased electromagnetic interference (EMI) shielding for an information handling system. The vent comprises two plates, wherein each plate comprises a plurality of structures. Each structure has a base opening with a first set of dimensions, a contact area with a second set of dimensions smaller than the first set of dimensions, and a wall extending at an angle from the base opening to the contact area. Each wall has a plurality of holes to increase the open percentage of the vent for decreased airflow impedance, which allows more airflow through the vent. The reduced size of each hole, the angled walls and continuous surface areas between adjacent structures reduce the amount of electromagnetic energy that can pass through the vent.