Multi-layered Circuit Board Stepped Paste Blocks
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Solution Overview
Problem
High-temperature lamination in multi-layered circuit board manufacturing can cause the base resin in conductive paste to flow, leading to short-circuits and ion migration issues, which existing technologies have not adequately addressed.
Innovation Solution
A method involving copper-clad laminates with dielectric layers and conductive paste blocks, where blind holes are defined and filled with conductive paste, and then processed to form stepped paste blocks that are pressed together to create a multi-layered circuit board, ensuring electrical connections without resin flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high temperature lamination is used to bond wiring layers, then the lamination strength is improved, but the base resin flows causing short-circuits and ion migration
Solution Approach 1:
The patent changes the temperature parameter during the lamination process. By controlling the lamination temperature to be below the glass transition temperature (Tg) of the base resin, the resin maintains its glassy state and does not flow, thus preventing short-circuits and ion migration while still achieving adequate lamination strength through optimized pressure and time parameters
Solution Approach 2:
The patent uses a composite structure consisting of multiple wiring layers alternating with dielectric layers. This layered composite architecture allows independent control of thermal parameters for each layer, enabling lamination at lower temperatures that prevent resin flow while maintaining structural integrity through the composite design
2Ease of manufacture
If conventional lamination process is used, then manufacturing simplicity is maintained, but resin flow causes short-circuits between conductive vias
Solution Approach 1:
The patent performs preliminary actions by pre-forming conductive paste blocks with protruding portions before lamination. These pre-formed structures ensure proper alignment and electrical connection between layers, eliminating the need for complex post-lamination adjustments and preventing short-circuits through precise pre-positioning of conductive elements
Solution Approach 2:
The patent modifies the lamination process parameters, specifically controlling temperature to remain below the resin's glass transition temperature. This parameter change prevents resin flow during lamination, thereby eliminating short-circuit formation between conductive vias while maintaining a relatively simple manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents short-circuits and ion migration by maintaining the integrity of the conductive paths, enhancing the reliability and precision of the multi-layered circuit board connections.
Implementation Method 1
the at least one first circuit base board and the at least one second circuit base board are pressed together
Data Source
AI summary
A multi-layered circuit board proofed against conductor loss or diminution when heated includes first and second circuit base boards. Each first circuit base board includes a first dielectric layer and a first wiring layer formed thereon and a first stepped paste block as a conductor formed in the first dielectric layer. The first stepped paste block is electrically connected to the first dielectric layer. Each second circuit base board includes a second dielectric layer and a second wiring layer, a second stepped paste block as a conductor is formed in the second dielectric layer. When pressed together for an electrical interconnection, the paste blocks are sealed and thus captive between the first and second circuit base boards.