Multi-layered Auxiliary Cooling Plate for Power Semiconductor Heat Dissipation
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Solution Overview
Problem
The existing cooling apparatuses for power semiconductors in eco-friendly cars face issues with interface reactions and partial melting when a two-layered auxiliary cooling plate with a copper layer and a filler layer is brazing welded to an aluminum cooler, leading to poor joining and heat transfer performance.
Innovation Solution
A multi-layered auxiliary cooling plate structure is introduced, comprising a copper layer, a reaction preventing layer made of steel or nickel, and a filler layer, which are joined to the aluminum cooler in a single brazing process to prevent interface reactions and enhance heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a two-layered auxiliary cooling plate with copper layer and filler layer is brazing welded to an aluminum cooler, then heat transfer capability is improved, but interface reaction and partial melting occur at the joining interface
Solution Approach 1:
The patent applies a three-layer composite structure consisting of a copper layer (for heat conduction), a reaction preventing layer (for interface stability), and a filler layer (for brazing). This composite material approach allows the system to simultaneously achieve high heat transfer capability through the copper layer while preventing harmful interface reactions through the intermediate reaction preventing layer, thus resolving the contradiction between heat transfer performance and joining interface stability.
Solution Approach 2:
The reaction preventing layer serves as an intermediary between the copper layer and the aluminum cooler. This intermediate layer prevents direct contact and harmful reactions between copper and aluminum during brazing, while still allowing effective heat transfer. The mediator layer resolves the contradiction by enabling both high heat transfer capability and interface stability simultaneously.
2Strength
If brazing temperature and time are increased to improve joining strength, then joining strength is improved, but interface reaction and melting are exacerbated
Solution Approach 1:
The reaction preventing layer acts as a protective intermediary that allows brazing to be performed at optimal temperatures without causing harmful interface reactions. This intermediary layer enables achieving strong joints while preventing the aluminum cooler from melting or reacting with copper, thus resolving the contradiction between joining strength and harmful interface reactions.
Solution Approach 2:
The patent changes the material parameters at the interface by introducing the reaction preventing layer, which has specific chemical and thermal properties that allow brazing to proceed at appropriate temperatures without causing melting or harmful reactions. This parameter change enables simultaneous achievement of high joining strength and prevention of interface damage.
3Device complexity
If a single-layer auxiliary cooling plate is used to simplify the structure, then device complexity is reduced, but heat transfer performance and joining reliability deteriorate
Solution Approach 1:
The patent employs a three-layer composite auxiliary cooling plate structure where each layer serves a specific function: the copper layer provides superior heat conduction, the reaction preventing layer ensures interface stability, and the filler layer enables reliable brazing. This composite structure resolves the contradiction by delivering enhanced heat transfer performance and joining reliability that a single-layer structure cannot achieve.
Solution Approach 2:
Different regions of the auxiliary cooling plate are assigned different material properties optimized for their specific functions. The copper layer is optimized for heat conduction, the reaction preventing layer for chemical stability, and the filler layer for brazing. This local quality differentiation resolves the contradiction between structural simplicity and performance by creating a multi-functional composite structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents interface reactions and improves heat transfer efficiency from the power semiconductor to the cooler, maintaining a stable joining state and enhancing the cooling performance of the power semiconductor.
Implementation Method 1
the copper layer functions to improve heat dissipation performance using high heat conductivity
Implementation Method 2
an auxiliary cooling plate of a two-layered structure is joined to the aluminum cooler
Data Source
AI summary
A cooling apparatus for a power semiconductor includes a cooler having a cooling path so that a cooling medium flows therein, and an auxiliary cooling plate of a multi-layered structure joined to a surface of the cooler with which the power semiconductor comes into contact. A method of manufacturing the cooling apparatus includes providing an auxiliary cooling plate of a multi-layered structure, providing a cooler having a cooling path so that a cooling medium flows therein, and joining the auxiliary cooling plate to a surface of the cooler with which the power semiconductor comes into contact, wherein the providing a cooler and the joining the auxiliary cooling plate are performed together in the same brazing process, so that a manufacture of the cooler and the joining the auxiliary cooling plate are simultaneously performed.